SICK has launched the new OD200, a compact laser distance sensor for measuring short ranges that sets new standards in this sensor class with its stability on highly reflective, dark, and irregular surfaces.

The ANS/ANM58 PROFINET from SICK Sensor Intelligence marks a new generation of absolute encoders specifically designed for higher machine and system productivity.

SICK Sensor Intelligence has launched the PBST touchscreen pressure sensor. Building on and complementing the company’s existing range of high accuracy, reliable, and robust pressure sensors/switches, the PBST multifunctional IO-Link sensor is SICK’s first ceramic cell pressure measurement sensor, delivering suppression of pressure spikes and surges, as well as corrosion resistance.

SICK has brought a new safety solution to the market with its End of Arm Safeguard (EOAS) for collaborative robots (cobots). The first of its kind, the EOAS enables closer collaboration between robots and humans.

Global industrial sensor expert SICK has unveiled the latest in its extensive product range with the IMG inductive sensor, designed specifically to provide stable detection in harsh environments.

Developed for high precision in the micron range, SICK’s OD7000 displacement sensor measures tiny distances in challenging electronics and solar manufacturing applications cost-effectively.

SICK has unveiled the first photoelectric sensor with a touchscreen display, heralding the future for universal and easy-set-up sensing.

SICK has added Liquid Lens technology to the Lector 61X, its smallest image-based code reader, to deliver rapid and infinitely-variable focal adjustment and a significantly-extended depth of field.

With the launch of its next-generation DT80 distance sensor, SICK has revised the standard for measurement precision in countless industrial applications in a compact and robust device. 

SICK has expanded its next-generation Ruler3000 family to focus on the speed and precision of its 3D streaming cameras on the finest details of high-quality, high-resolution 3D inspection and measurement tasks.

SICK has added the UC40, a powerful and compact cube sensor, to its market-leading family of ultrasonic sensors. 

SICK has announced a major advance in its colour sensor portfolio, with the launch of its CSS and CSX high resolution and high-speed devices.

SICK has unveiled a milestone advance in its three-dimensional LiDAR technology with the launch of the multiScan multi-layered LiDAR sensor.

SICK has unveiled its next-generation family of large-bore hollow-shaft incremental encoders, the SICK DGS80.

SICK has launched the safeRS3, a next-generation safe 3D radar system designed to enable maximum productivity with highly-reliable safe access protection for workers in hazardous industrial areas, including robot cells.

SICK has announced the launch of its MPB10 Multi-Physics Box condition monitoring sensor, a rugged bolt-on device designed to deliver real-time, continuous service data from industrial machines, including electric motors, pumps, fans, and conveyor systems, even in the harshest industry environments.

SICK and MVTec Software are deepening their strategic cooperation. Algorithms of MVTec's HALCON machine vision software will be integrated into SICK's sensors. The corresponding agreement was signed by Dr. Martin Schenk, Senior Vice President Product Management SICK, and Dr. Olaf Munkelt, Managing Director MVTec Software, at the SPS trade fair in Nuremberg on the 9th November. 

Fibre optic sensors are often favoured in electronics applications for their high switching speeds and ability to detect tiny objects.

SICK launches its next-gen, intelligent and powerful WLL80 Fibre Optic Sensors, designed for simple configuration and versatile integration into machinery and conveyor systems in electronics production, wherever rapid, high accuracy detection is required in confined spaces.

SICK has announced that it is launching its first vision camera with a pre-installed deep learning app onboard to make it simple to create custom quality inspections of complex electronics parts and surface mount assemblies.