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Nexperia

Nexperia Articles

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News & Analysis
24th March 2020
Scheper stands down as CEO of Nexperia

Nexperia CEO Frans Scheper is taking early treatment just three months after China-based Wingtech took a controlling stake in the company. 

Design
27th February 2020
Developing a GaN-based EV inverter design

Nexperia has announced a partnership with automotive engineering consulting company, Ricardo, to produce a technology demonstrator for an EV inverter using GaN-based technology. Gallium nitrade (GaN) is the preferred switch for these applications as GaN FETs lead to systems with greater efficiencies at lower costs with improved thermal performance and simpler switching topologies.

Power
30th January 2020
Low RDS(on) MOSFET improves performance

Nexperia has announced the release a low RDS(on) MOSFET. The PSMNR51-25YLH aims to set a new standard of 0.57mΩ at 25V. Utilising Nexperia’s NextPowerS3 technology, this performance is offered without compromising other important parameters such as maximum drain current (ID(max)), Safe Operating Area (SOA) or gate charge QG.

Power
24th January 2020
Computing in cars

  Designing reliable hardware is challenging the automotive industry, says Jan Preibisch, application marketing manager, Nexperia

Analysis
24th December 2019
Nexperia eyes China growth with new owner

Nexperia has a new owner. Wingtech Technology – a Chinese computer and telecom equipment manufacturer – has officially obtained a controlling stake in the company from Beijing Jianguang Asset Management (JAC Capital). The deal enables Nexperia to pursue a goal of increasing its business in China according to CEO Frans Scheper.

Passives
11th December 2019
Common mode filters feature integrated ESD protection

Nexperia has announced a fast common mode filter (choke)/ESD protection combination. The new PCMFxUSB3BA/C features a wide differential passband of up to 10GHz 3dB frequency and a very high surge robustness of up to 7.5A 8/20µs. It is designed to suppress common mode and single-ended noise while minimising the impact on the signal integrity of extremely fast data lines.

Power
22nd October 2019
High quality, high reliability, AEC-Q101-qualified devices in DPAK

Nexperia has announced new high quality, high reliability automotive (AEC-Q101-qualified) and consumer/industrial-qualified MJD three and eight amp power bipolar transistors. The product family includes eight parts housed in the DPAK (TO-252/SOT428C) package and offered in both 80 and 100V NPN and PNP versions.

Analysis
13th September 2019
Semiconductor company secures financing to fund future growth plans

Nexperia, an expert in discrete and MOSFET components and analogue & logic ICs, has announced the successful raise of $1,500 million equivalent of senior credit facilities. The proceeds will be used to refinance the existing outstanding debt and to partly finance the acquisition by Wingtech Technologies, a listed Chinese computer and telecom equipment manufacturer.

Analysis
23rd July 2019
Nexperia wins Global Supplier Award

Nexperia has announced that it has received a Bosch Global Supplier Award in the category ‘Purchasing of direct materials, Mobility Solutions’. Nexperia was one of only 47 companies from Bosch’s 43,000-strong supplier base to be honoured with such an award for its outstanding performance and teamwork in 2017 to 2018.

Passives
15th July 2019
Diodes and transistors suitable for high temperature applications

Nexperia has announced that key parts from its SOT23-packaged family of high-performance, general-purpose transistors and switching diodes are now fully-specified for operation up to 175°C. Included in the range are high-speed switching diodes BAS16/21 and BC807/817 general purpose transistors.

Power
1st April 2019
Automotive LED drivers deliver 250mA output current

Nexperia has extended its constant current LED driver family with eight new AEC-Q101 qualified devices to drive low- and medium-power LEDs up to 250mA. The 16V NCR32xx and 40V NCR42xx series are available in two package styles, the space-saving SOT457 (SC-74) and the SOT223 (SC-73), a slightly-larger option which delivers a higher power capability of up to 1,250mW.

Power
25th March 2019
Lowest RDS(on) MOSFETs without compromising vital parameters

Specialist in discretes, logic and MOSFET devices, Nexperia, has announced that its lowest-ever RDS(on) NextPower S3 MOSFETs in Trench 11 technology has been achieved without compromising other important parameters such as drain current (ID(max)), Safe Operating Area (SOA) or gate charge QG.

Power
6th March 2019
Automotive logic parts 64% smaller than leaded equivalents

Specialist in discretes, logic and MOSFET devices, Nexperia, has announced that over twenty logic types in the company’s space-saving leadless MicroPak packages are now AEC-Q100 qualified. These logic solutions claim to be the smallest devices of their type suitable for automotive applications and Nexperia’s Q100 portfolio exceeds the Automotive Electronics Council’s requirements.

Power
14th February 2019
Automotive MOSFETs for demanding powertrain applications

Global specialist in discretes, logic and MOSFET devices, Nexperia, has introduced a portfolio of low RDS(on) 40V AEC-Q101 MOSFETs targeting space-constricted, increased-power modules in demanding powertrain applications. Housed in the miniature, LFPAK33 package which has a footprint of only 10.9mm² and a pitch of just 0.65 mm, devices use Nexperia’s Trench 9 technology.

Power
13th September 2018
MOSFETs in miniature packages enable automated inspection

Nexperia has announced the industry’s first AEC-Q101-qualified MOSFETs that are both rated for use at up to 175°C and are available in the AOI-compatible DFN2020 package. More, the devices measure just 2mm x 2mm, much smaller and lighter than SOT223 and SO8-packages yet with comparable electrical and thermal performance.

Power
28th August 2018
Logic package reduces assembly costs and increases reliability

  Nexperia has announced the four pin X2SON4 package which is the smallest logic package that can be used without requiring an expensive and fragile step-down mask. Therefore, PCB assembly is quicker, easier, more reliable and more cost effective.

Passives
5th July 2018
ESD protection series deliver high surge robustness

Nexperia has announced that it has optimised its TrEOS ESD protection diode series for use with USB Type-C interfaces. The new USB3.2 standard introduces an optional capacitor at the Rx inputs, so Nexperia is now launching two groups of devices, one that delivers extremely high surge robustness for positioning between the connector and capacitor, and a second that has an extremely low trigger voltage for placement between capacitor and the s...

Power
7th June 2018
Lowest RDS(on) automotive MOSFETs down to 0.9mΩ

Nexperia has announced the release of the company’s lowest RDS(on) automotive-qualified MOSFETs. The AEC-Q101 Trench 9, 40V automotive superjunction MOSFETs in the rugged, electrically- and thermally-efficient LFPAK56E deliver a footprint reduction of up to 81% when compared to traditional solutions such as bare die modules, D2PAK or D2PAK-7 devices. The 0.9mΩ, 220ADC-rated BUK9J0R9-40H MOSFET suits applications up to 1.2kW, and is al...

Analysis
19th April 2018
Nexperia secures $800m financing to fund future growth plans

Nexperia has announced the completion of a refinancing of its current facilities with $800m equivalent of senior credit facilities. This includes a significant proportion of Revolving Credit facility. The proceeds will be used to refinance existing outstanding debt and for Capex expenditure to fund future growth. The facilities were arranged by Bank of America Merrill Lynch and HSBC, acting as Global Coordinators, and were syndicated by a gr...

Power
12th March 2018
Broad range of space-saving PN and Trench Schottky rectifiers

Nexperia has announced the launch of a wide range of PN and Trench Schottky rectifiers for power applications including automotive, industrial and consumer. In total, the company now offers more than 90 devices in the CFP packages. Nexperia CFP packaging is size- and thermally-efficient. The package design has a solid copper clip and exposed heat sink to reduce the package’s thermal resistance and optimise the transfer of heat into the...

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