Nexperia, an expert in essential semiconductors, has released its first Power GaN FETs in e-mode (enhancement mode) configuration for low (100/150V) and high (650V) voltage applications.

Nexperia has introduced a portfolio of 16-channel I2C general-purpose input-output (GPIO) expanders designed to increase flexibility and reuse in electronic systems.

Nexperia has introduced a 650V Silicon Carbide (SiC) Schottky diode designed for power applications which require ultra-high performance, low loss, and high efficiency. 

Nexperia has announced an expansion to its range of Power ICs with Energy Harvesting solutions to simplify and enhance the performance of low-power IoT and other embedded applications.

Paige West speaks with Chris Boyce, Senior Director, Marketing & Product Group, BG MOS Discretes, Nexperia about LFPAK technology.

Nexperia has announced the release of its first 80V and 100V application specific MOSFETs (ASFETs) for hotswap with enhanced safe operating area (SOA) in a compact 8x8mm LFPAK88 package.

Nexperia introduced an AEC-Q101 qualified portfolio with six ESD protection devices (PESD2CANFD36XX-Q) designed to protect bus lines in automotive in-vehicle networks (IVN) such as LIN, CAN, CAN-FD, FlexRay and SENT from damage caused by electrostatic discharge (ESD) and other transients.

Two decades ago, Nexperia transformed the semiconductor industry with a unique clip-bond package for power MOSFETs. This disruptive innovation was called LFPAK, offering the lowest power losses of any package on the market. It was revolutionary, offering radical performance improvements that gave early adopters extraordinary improvements in performance, efficiency and size. Backed by 20 years’ continuous innovation, the story continues.

Nexperia extended its ‘ASFETs for Hotswap and Soft Start’ portfolio with the introduction of 10 new 25V and 30V fully optimised devices, combining enhanced safe operating area (SOA) performance with extremely low RDS(on), making them ideal for use in 12V hotswap applications including data centre servers and communications equipment.

Nexperia announced the expansion of its portfolio of Clip-bonded FlatPower (CFP) packaged diodes for industrial and automotive applications.

Nexperia announced a broadening to its portfolio of power management products to include energy harvesting solutions.

The rate of technology innovation is increasing, but one of the revolutions that inspired a shakeup of MOSFET packaging was the fast-evolving computing industry of the 1990s, when one of the areas that saw a seismic shift was in how to improve the performance available from the MOSFET packages.

With the entire electronics industry in one exhibition, electronica is a must visit event on everyone’s calendar. And this year Nexperia is proud to be part of it (Hall C3, booth 319). Come and explore our latest technologies and product offering or discover how we can help you innovate and empower your next design. Join us November 15-18 in Munich!

Nexperia, the specialist in essential semiconductors, has announced the latest additions to its rapidly expanding portfolio of Clip-bonded FlatPower (CFP) packaged diodes for industrial and automotive applications.

Three new devices in DSN1006 and DSN1010 save power and simplify thermal management in space-constrained applications

DFN0603 package improves performance while reducing space needs significantly                          

Drawing on decades of expertise as an industry leader in the production of discrete components, Nexperia introduces the ultra-small DFN0603 package. Measuring only 0.63 x 0.33 x 0.25 mm, using 13% less space, with a 74% reduction in RDS(on) than the next smallest MOSFET package in the market (DFN0604). Helping to improve efficiency and thereby enabling end equipment designers to achieve greater power density. 

Nexperia’s Diode Application Handbook is a unique collection of technical materials and application examples. Providing useful guidance on topics and issues that the design engineer is likely to encounter, as diodes remain a very important component of electronic systems. Written by engineers for engineers this reference work represents the collected knowledge of some of our industry’s most respected experts. 

Nexperia and KYOCERA AVX components salzburg agree partnership for gallium nitride automotive power modules.

The increasing number of electronic functions in modern cars must be realized within a given space necessitating components to shrink in size. However, smaller packages need to dissipate the same amount of heat on a reduced footprint, leading to a higher power density on the board. DFN packages with their compact dimensions and thermal properties are the right choice.