Molex Incorporated

  • Molex 2222 Wellington Court Lisle, IL 60532-1682
    United States of America
  • 1 800-78MOLEX
  • (1) 630-968-8356

Molex Incorporated Articles

Displaying 61 - 80 of 557
19th June 2018
Connector system is the fastest way to de-energise industrial machines

In this video, Molex looks at incorporating many options and components into a smooth, contoured design. 

18th June 2018
Waterproof connector provides IP66 and IP67 protection

Molex has introduced a D-Sub form factor Earthing Connector to help customers make secure and robust earthing connections without the use of special tools or specialist training. The connector is designed for hash environments and meets IP66 and IP67 requirements. The Earthing Connector protects equipment from stray voltages through a secure and low-impedance connection to earth.

23rd April 2018
Latest sealed connector system offers increased reliability

Molex has announced the Squba 1.80mm-Pitch Sealed Wire-to-Wire Connector System, designed to fit in small spaces and provide protection against liquid, dust and dirt. The connectors carry up to a 6.0A current and provide an IP67 NEMA rating on the seals. Seals are retained with caps to provide manufacturers of sensors, lighting, vending machines and liquid dispensers with a durable barrier from moisture and dust.

17th April 2018
SFP-DD releases updated specification for pluggable interface

The Small Form Factor Pluggable Double Density (SFP-DD) Multi Source Agreement (MSA) Group has released an updated specification for its pluggable interface. The MSA consortium initially released the SFP-DD specification (version 1.0) in September 2017.

16th March 2018
Portable tool helps first responders detect carbon monoxide levels

  Molex subsidiary, Sensorcon has introduced the CO Inspector, a portable meter that uses advanced electrochemical sensor technology to quickly detect and measure carbon monoxide, and alert fire, police and rescue personnel to dangerous levels.

Tech Videos
14th February 2018
Let's support the future of connected mobility

In a continuing effort to support the future of connected mobility, Molex has developed a connected vehicle technology ecosystem. 

6th February 2018
Custom combo blade headers eliminate the need for pin insertion

Provider of electronic components and solutions, Molex, has introduced Custom Combo Blade and Pin Setters, which eliminate the need for pin insertion and stitching equipment, creating a more flexible and more robust pin interface. Randy Tan, Global Product Manager, Molex, said: “Because Custom Combo Blade and Pin Headers are soldered into the board instead of press-fit, it creates a stronger connection.

2nd February 2018
Connector provides high performance in compact size

Molex has released the Micro-Lock Plus Wire-to-Board Connector System as a suitable solution for customers seeking high performance, compact size and retention security. Featuring a 1.5A current rating, small footprint and positive latch, Molex has developed a comprehensive terminal solution for OEMs working in space-constrained environments.

30th January 2018
Acquisition strengthens energy management technologies

Global manufacturer of complete interconnect solutions, Molex has announced the acquisition of certain assets of Triton Manufacturing Company. The acquired Triton business specialises in fabricating flexible power cable assemblies and custom bus bars used in a wide range of current and heat transfer applications, including power transfer devices for computers, industrial electrical power distribution, transportation, aerospace and ...

17th January 2018
MSA group targets high-speed and high-density interfaces

The Small Form Factor Pluggable Double Density (SFP-DD) Multi Source Agreement (MSA) group have completed the initial hardware specification and drawings for the SFP-DD pluggable interface designed to enable high-speed, high-density networking equipment. Targeting support up to 3.5W optical modules in an enterprise environment, the SFP-DD form factor addresses the technical challenges of achieving a double-density interface and ensuring mechanica...

Events News
8th January 2018
Duo debut 10Gbps Ethernet automotive platform at CES 2018

Designed to accelerate data bandwidth in intelligent connected vehicles, Molex and Excelfore have teamed up on the development of a 10Gbps Ethernet Automotive Network. Integrating highly reliable high speed data transmission, prioritisation, scalability and security, the Molex network platform featuring Excelfore connected mobility solutions will be officially unveiled at the Consumer Electronics Show, 9th-12th January, 2018, Las Vegas,...

3rd January 2018
MSA group drives development of next-gen network technologies

The 100G Lambda Multi-Source Agreement (MSA) Group has announced their intent to develop specifications based on 100 Gbps per wavelength optical technology. Under the MSA, participating companies are addressing the technical challenges of achieving optical interfaces utilising 100Gbps per wavelength technology ensuring optical interoperability for transceivers and interfaces produced by different manufacturers and in various form factors.

15th December 2017
Illuminating interior lighting and testing

Through a collaboration with Radiant Vision Systems, Molex has improved its design and testing of illuminated USB connectivity modules used in automotive dashboards. By utilising Radiant’s ProMetric Imaging Colorimeter, Molex design engineers have enhanced their design, measurement, and production capabilities for illuminated components, such as halo lighting on USB ports and auxiliary jacks.

28th November 2017
Reducing harness assembly lead time with termination connector

  Molex has introduced the MUO 2.5 Termination Connector, designed to replace Closed-End (CE) terminals. It will reduce cable assembly time for OEMs, as well as improve reliability and processing time.

20th November 2017
Wire-to-board connector meets industry needs with vertical mating

  Designed to provide reliable connection in a compact profile that improves both reliability and assembly speed is the Pico-EZmate Slim 1.2mm Pitch Wire-to-Board Connector from Molex.

Events News
10th November 2017
Molex helps future-proof your investment at Agritechnica

As commercial vehicles become connected vehicles, how do you integrate the latest technology while protecting against some of the toughest conditions on earth? Invest in technology that pairs next-generation innovation with proven reliability. These are just some of the questions Molex will look to answer at this year’s Agritechnica show, Hall 17 – Booth 32, 12th-18th November 2017.

23rd October 2017
USB smart modules to assist connectivity in vehicles

  Electronic manufacturer, Molex has merged automotive-grade durability with mass availability on its line of USB Smart Charge Modules. Manufactured specifically for customers automotive and commercial vehicles that require a smart-charge USB module, Molex products feature design to give users maximum performance.

Events News
4th October 2017
Sealed connection system on display at EDS 2017

At this year’s Engineering Design Show, taking place 18th to 19th October, Molex (stand K18) will showcase its multi-dimensional approach in meeting the most demanding needs of the design industry. The company will have on display a diverse representation of its products that support a wide-range of applications in a variety of connector sizes and shapes. These products provide design engineers with the ultimate in flexible, scalable soluti...

18th September 2017
Space-saving solutions deliver superior reliability and durability

  A range of gold-plated Pico-Clasp Wire-to-Board Connectors has been introduced by Molex in single row inner lock vertical and right angle header versions, joining the existing dual-row gold-plated and single-row tin-plated versions.

18th August 2017
Upgraded interconnect system provides higher speeds

  Through expanding its zSFP+ Interconnect System to support 56Gbps PAM-4 channels in a stacked 2xN port configuration, Molex is allowing next-gen Ethernet and fibre channel applications to receive signal integrity. OEMs requiring high-density interconnect applications now have the ability to utilise channels with individual lane data rates up to 56Gbps PAM-4 in a stacked 2xN configuration.

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