It has been announced that Molex is expanding its autonomous and connected vehicle capabilities by working with Accenture and Amazon Web Services (AWS) to bring edge computing and voice assistant capabilities to the Molex Automotive Ethernet Network Platform. These new digital enhancements to the Platform offer essential autonomous vehicle performance and communication functionality for automotive OEMs.

  Molex will showcase the next evolution of its 10Gbps Automotive Ethernet Network Platform at the fifth annual Automotive Ethernet Congress (AEC) being held 13th and 14th February 2019 at The Westin Grand, Munich, Germany. This solution is designed to support OEMs in their development and design of autonomous vehicles.

Global manufacturer of electronic solutions, Molex, has announced a collaboration with Ixia, a Keysight Business, in a joint demonstration at DesignCon 2019 on January 30th to 31st at booth 631. The demonstration will show Ixia’s AresONE 8x400GE test system generating a combined 3.2Tbps live Ethernet traffic over Molex QSFP-DD passive copper direct attach cable (DAC) assemblies at up to three meters to the device under test.

Molex announced at CES 2019 the next evolution of its 10Gbps Automotive Ethernet Network Platform designed to support OEMs in the development and design of autonomous vehicles.

It has been announced that Molex is expanding its autonomous and connected vehicle capabilities by working with Accenture and Amazon Web Services (AWS) to bring edge computing and voice assistant capabilities to the Molex Automotive Ethernet Network Platform. These new digital enhancements to the Platform offer essential autonomous vehicle performance and communication functionality for automotive OEMs.

Molex announced it has completed the acquisition of the Connected Vehicle Solutions ('CVS') division of Laird Limited, owned by funds managed by Advent International. On 28th September 2018, Molex announced an agreement to acquire CVS, which specialises in the design, development and delivery of vehicle antenna systems, smart device integration and vehicle connectivity devices.

  Molex recently launched the stAK50h Unsealed Connection System, designed to deliver both signal and Ethernet connectivity in automotive body electronics, safety and driver assist, comfort and infotainment devices and modules.

  Molex is meeting the increased demand for in-vehicle processing power. Top tier automakers are facing new challenges as they strive to build next-generation, intelligent vehicles. They require agile connectivity solutions with seamless end-to-end network integration across hardware, software and services.

The release of a new set of 1.00mm pitch wire-to-board Pico-Clasp Connectors has been announced by Molex. The connectors offer a variety of mating styles and orientations, plated in either tin or gold to meet flexible design specifics. Molex Pico-Clasp Wire-to-Board Connectors are suited for customers in the consumer, industrial, automotive, and medical industries.

  Molex offers the Coeur CST High-Current Interconnect System featuring a new float design that accommodates pin to socket misalignment allowing for ease of mating PCB to PCB, PCB to bus bar, or bus bar to bus bar without the risk of overstress damage to the socket contact system.

With sensors providing the essential steps of analysing and communicating high-level data to cloud-based applications, a collaboration between Molex and Contrinex aims to further strengthen Molex’s Industrial Internet of Things (IIoT) solution offerings and positions the company as an end-to-end solution provider for industrial automation.

Molex has released a white paper for electronics design engineers and product developers addressing growing consumer demand for smart home automation technologies. It examines home technology trends as the IoT continues to drive the evolution from simply connected to truly smart and proactive — and outlines how electronics designers and manufacturers can successfully position themselves to maximise future opportunities and demand.

The new Coeur CST High-Current Interconnect System featuring a new float design that accommodates pin to socket misalignment allowing for ease of mating PCB to PCB, PCB to bus bar, or bus bar to bus bar without the risk of overstress damage to the socket contact system is the latest innovation from Molex.

To meet the increased demand for in-vehicle processing power, Molex showcased a lot of new technologies at this year's electronica. Molex understands that top tier automakers are facing new challenges as they strive to build next-generation, intelligent vehicles, they equire agile connectivity solutions with seamless end-to-end network integration across hardware, software and services. 

A whitepaper for electronics design engineers and product developers has been released by Molex, addressing growing consumer demand for smart home automation technologies. It examines home technology trends as the IoT continues to drive the evolution from simply connected to truly smart and proactive. 

Molex in collaboration with Ixia announce a joint demonstration at the European Conference on Optical Communication.

  Two FFC/FPC connectors designed to serve the growing information market needs of automakers and television display manufacturers, as well as designers requiring small-pitch, high-reliability connectors, have been announced by Molex.

Molex has announced its full line of next-generation data centre infrastructure solutions to address expanding hyperscale requirements, including higher bandwidth and increasing data rates. Molex data centre solutions are designed in close collaboration with customers and are based on decades of proven expertise in developing high-speed solutions for OEMs in the server, storage and networking industries.

Two global leaders in the design and manufacture of interconnects for high-performance electronic products have announced a Licensed Source Agreement which brings together innovations that provide a new generation of solutions to meet the evolving needs of 56G and 112G data speeds.

Molex has introduced the CP3.3 Wire-to-Wire Connector System, designed to allow multiple same-circuit connectors to be used in products ranging from electronics and white goods to industrial and medical applications. The colour-paired connectors ensure correct mating connection, which also reduces the time needed to properly connect circuits during assembly. The connectors are fully polarised with an inertia lock that enhances user safety while p...