Kyocera’s development of this innovative ceramic packaging is based on established HTCC technology (High Temperature Co-Fired Ceramics), which is currently used with specific “non-magnetic” piece parts and plating options. Kyocera is now presenting a new type of HTCC with platinum metallization on the top surface and in ceramic multilayering. Besides the “non-magnetic” property of platinum metallization, this unique technique and choice of materials also allows for use in high temperature applications up to 1.000°C. For instance, the wireless SAW temperature sensor of the company Vectron, which can be used to screen temperatures up to 600° C, has been developed based on Kyocera’s component package. Furthermore, customized packages for individual applications can be delivered, for example, the design can include or omit leads and can also be made compatible with a surface mountable concept if required.