Coordinated by Infineon Technologies AG, the research project Design methods and hardware/software co-verification for the unique identifiability of electronic components has begun operations. 12 partners from the research and academic sectors as well as from electronics and end user industries are working together to develop a holistic security concept for the Internet of Things. The VE-VIDES goal is to already systematically identify poten...

What if your everyday eyeglasses became the next media for augmented reality applications? What if every car could display valuable data on the whole windshield to securely guide you through the traffic? The new MEMS (Micro Electro Mechanical Systems) scanner solution from Infineon Technologies, comprising a MEMS mirror and MEMS driver, allows completely new product designs. Its miniature size and low power consumption are the basis for making au...

GaN brings efficiency advantages compared with silicon, say Giuseppe Bernacchia, senior principal application engineer and Moshe Domb, director application engineering at Infineon Technologies

It is often the case that when components are targeted at large currents and voltages the amount of applications that they can be used in shrinks.

Infineon introduces industry’s first USB PD 3.1 high-voltage microcontroller with higher wattage support

Space-grade field-programmable gate arrays (FPGAs) require reliable, high-density non-volatile memories that contain their boot configurations. To address the growing need for high-reliability memories, Infineon has announced a high-density radiation-tolerant (RadTol) NOR Flash memory products qualified to MIL-PRF-38535’s QML-V flow (QML-V Equivalent). The QML-V flow is the highest quality and reliability standard certification for aerospac...

Cost-effective dimmable and intelligent LED systems are expected to increase the market share disproportionately in the coming years. Introducing the ICL8800, ICL8810 and ICL8820 single-stage flyback LED controllers for constant output voltages, Infineon Technologies has addressed the need of LED driver manufacturers in this regard.

Convenient Security: A research report by ABI Research has projected the market for biometric smart cards to be reaching 353 million pieces per year by 2025 globally as an optimistic scenario. Allowing card manufacturers to address this new growing market segment, Infineon Technologies and IDEX Biometrics ASA have announced a reference design for the next generation biometric smart card architecture.

Today, practically any everyday object can be enriched with smart functions to make life easier. Using system solutions from Infineon, Deed, a deep tech startup from Turin, Italy, has been able to create a screenless yet feature-rich wearable. The get bracelet interprets human gestures and uses biometric data to pick up a call or to make payments.

TomTom GO Discover, developed by TomTom is one of the quickest and most powerful satnavs on the market today. The satnav with its five, six and seven-inch display leverages the AIROC CYW43455 WiFi and Bluetooth combo chip from Infineon Technologies.

The latest phone designs focus on solutions that allow a full-screen display and avoid the notch, punch-hole cameras, or bezels without compromising on quality or performance. Infineon Technologies together with its Time-of-Flight (ToF) partner pmdtechnologies and ArcSoft are developing a turnkey solution that allows a ToF camera to work under the display of commercial smartphones.

With the innovative TO-Leadless (TOLL) package, Infineon now offers two new OptiMOS power MOSFET packages in the TOLx family: TOLG (TO-Leaded with Gullwing leads) and TOLT (TO-Leaded Top-side cooling). Together, the TOLx family offers very low R DS(on) and a high-current rating over 300A to increase system efficiency in high-power density designs.

Reduced complexity together with increased functionality and efficiency are dominating the agenda of all lighting manufacturers. In this regard, Osram and Infineon Technologies have joined forces to enable Near Field Communication (NFC) programming for the industry.

Infineon Technologies has expanded its growing portfolio of single-channel gate-driver ICs. The new EiceDRIVER 1EDB family of single-channel gate-driver IC provides galvanic input-to-output isolation of 3kV rms (UL 1577) that ensures rugged ground-loop separation.

Infineon Technologies has announced that it will highlight its range of power management solutions during the 2021 APEC Virtual Conference and Exposition from 14th to 17th June. With a device portfolio that spans silicon and wide bandgap (WBG) devices, engineers look to Infineon for solutions that balance performance, efficiency, reliability and cost. Infineon’s power solutions set the pace for innovations that make life easier, s...

Infineon Technologies supplied Samsung Electronics with 600V CoolMOS PFD7 power devices to couple the highest energy efficiency with lowest audible noise. They have been integrated in Samsung’s brand new one-door fridge (RR23A2J3XWX, RR23A2G3WDX) and FDR (French Door Fridge: RF18A5101SR) inverterised refrigerator. Inverterisation is an emerging DC to AC conversion trend in contemporary inverter designs.

The combination of AI and IoT, known as the Artificial Intelligence of Things (AIoT), provides machine learning capabilities in connected devices, enabling them to perform intelligent tasks. According to Markets and Markets, the AIoT market is expected to increase from $5.1bn in 2019 to $16.2bn by 2024, growing at a CAGR of 26%.

Today's advanced driver assistance systems (ADAS) are based on cameras, radar or lidar. As a result, their target objects need to be within the line of sight to be recognised by the system. This, however, turns into a weakness when it comes to emergency vehicles – they can be heard much earlier than they can be seen and thus are invisible to ADAS for a longer time.

Infineon Technologies has announced its next-generation 144-Mb Quad Data Rate II+ (QDR-II+) SRAM that is certified to the DLA Qualified Manufacturers List Class V (QML-V). QML-V is the highest quality and reliability standard certification for aerospace-grade ICs. This radiation-hardened (rad hard) 144-Mb QDR-II+ SRAM is a unique high-speed external cache memory ideal for radar, on-board data processing and networking applications in space.

Infineon Technologies has concluded a supply contract with the Japanese wafer manufacturer Showa Denko K.K. for an extensive range of silicon carbide material (SiC) including epitaxy. The German semiconductor manufacturer has thus secured more base material for the growing demand for SiC-based products.