IM Intelligent Memory

Intelligent Memory (or IM) has been developing memory products for demanding industrial applications since 1991 (as Pacific Force Technology Limited until 2013). Their comprehensive product portfolio consists of DRAM ICs and modules, as well as a broad variety of managed NAND products for industrial applications. All of Intelligent Memory’s solutions have been designed to meet the industry’s demands for quality, reliability, and product longevity.

IM Intelligent Memory Articles

Displaying 1 - 11 of 11
8th April 2024
Intelligent Memory releases DDR5 modules: commercial, industrial, and RoHS-compliant

Intelligent Memory (IM), a manufacturer of industrial-grade memory product solutions, is launching a family of DDR5 memory modules in commercial and industrial temperature ranges as well as in completely lead-free options.

29th February 2024
Intelligent Memory launches longevity industrial SD and microSD cards

Intelligent Memory (IM) will showcase its new microSD and SD cards with capacities of 512MB, 1GB and 2GB at embedded world 2024 in Nuremberg in hall 1, booth 340 from April 9 to 11.

28th February 2024
Going beyond P/E cycles – what really defines NAND flash endurance

All too often, NAND flash manufacturers advertise program/erase (P/E) cycles as a true representation of endurance. However, using this metric to estimate the lifetime of NAND flash will always provide an overly optimistic result.

27th September 2023
: Intelligent Memory and Simms International Join Forces at EDS 2023

Intelligent Memory, a manufacturer of industrial-grade memory product solutions, and Simms International, a specialized distributor of memory and storage solutions, are joining forces at the EDS 2023 trade show in Coventry, October 11-12.  Visit Simms and IM at stand F9 to check out IM’s comprehensive line-up of DRAM and NAND Flash memory products, which prioritize durability, reliability, and long-lasting availability.

31st August 2023
DRAM: how one transistor and one capacitor have changed the world

In June 1968 a patent was granted for the idea of a single transistor, single capacitor memory cell idea. That was the birth of DRAM memory. This memory cell structure is so ubiquitous today, that it’s hard to see how radical this new approach was.

22nd May 2020
16 Gigabit DDR3 memory from I’M Intelligent Memory

I'M Intelligent Memory has doubled its maximum offerings of DDR3 memory-capacity again to 16 Gigabits per component. While most DRAM manufacturers produced DDR3 memory with a maximum of 4Gb per chip, Intelligent Memory followed its motto ‘beyond limits’ having offered DDR3 devices with 8Gb capacity for more than six years.

13th December 2019
Samples released for ECC DRAM product line

Four years after bringing the first DRAM with on-chip ECC in DDR1, DDR2 and DDR3 technologies to the market, Intelligent Memory is expanding the product line again adding a new series of LPDDR4(X) memory components with integrated ECC error-correction capability.

20th February 2018
8Gb components support DDR3L low-voltage operation

Hong Kong based fabless DRAM manufacturer, I'M Intelligent Memory, has announced the availability its newest revisions of 8 Gigabit DDR3L components. Orderable devices include x8 (1Gx8) configurations in FBGA 78 ball package and x16 (512Mx16) types in FBGA 96 ball package. Customers can choose the devices to have either a single Chip-Select (1CS) or dual Chip-Select (2CS) pinout.

3rd April 2017
SDRAM memories have integrated error correction

Memory manufacturer, Intelligent Memory, has released DRAMs in traditional SDRAM-technology with on-chip ECC functionalities. As IM started off their ECC DRAM series with DDR1, DDR2, DDR3 and LPDDR technologies originally, now coming up with SDRAM-devices sounds like a technological step backward.

21st August 2015
ECC DRAMs operate up to 125°C

  A family of robust ECC DRAM components withstanding even the highest operating temperatures and stress has been released by Intelligent Memory.

16th July 2014
'World's first' 8Gb DDR3 components with single chip-select

8Gb DDR3 components with a single chip-select, claimed to be the world's first, have been introduced by I'M Intelligent Memory. The JEDEC specification JESD79-3 has always allowed an 8Gb density for DDR3 memory devices. While most DRAM manufacturers are waiting for a 2 x nm process to fit such high memory capacity into a single DRAM IC package, I’M has manufactured 8Gb DDR3 components utilising existing 30nm manufacturing technolo...

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