“It was time to go to the next level and double the memory-capacity again,” said Joseph Chan, General Manager of I’M, presenting the new components with 16Gb.
The new 16Gb devices support DDR3L low-voltage (1.35V) operation and are fully backward-compatible to standard DDR3 1.5V operation. Ordering options include different speed grades from 1333MT/s to 1866MT/s as well as commercial and industrial temperature ranges.
The 16Gb parts are compatible to JEDEC specification JESD79-3F for DDR3/DDR3L, internally operating in two ranks of 8Gb, requiring a board-layout with support for two sets of control-lines (CS, CKE, ODT, ZQ) for each DRAM.
With dimensions of only 9x13mm for the FBGA96 package, the device is small enough to fit on a majority of existing layouts.
Customer Samples are ready to ship in a x16 configuration with FBGA 96 ball package right away. A 78 ball FBGA version in x8 configuration is not yet being produced, but could follow if customers show a demand for them.
I’M Intelligent Memory supplies the complete range of memory-capacites for DDR3 from 1Gb over 8Gb up to the technical maximum of 16Gb per component.