CEA / Leti

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38054
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Phone: +33(0) 4 38 78 31 95

Web: http://www-leti.cea.fr


CEA / Leti articles

Displaying 1 - 20 of 56

Edge-AI targeted with NVM memory cell

Edge-AI targeted with NVM memory cell
Researchers at CEA-Leti and Stanford University have reportedly developed a circuit integrating multiple-bit non-volatile memory (NVM) technology called Resistive RAM (RRAM) with silicon computing units, as well as new memory resiliency features that provide 2.3-times the capacity of existing RRAM.
25th February 2019

Combined integrated optics and holography in AR technology

Combined integrated optics and holography in AR technology
An institute of CEA-Tech, Leti, has developed a novel retinal-projection concept for augmented reality (AR) uses based on a combination of integrated optics and holography. The lens-free optical system uses disruptive technologies to overcome the limitations of existing AR glasses, such as limited field-of-view and bulky optical systems.
8th February 2019

Mid-infrared optical sensors for portable devices

Mid-infrared optical sensors for portable devices
It has been announced by CEA-Leti that it has prototyped a next-generation optical chemical sensor using mid-infrared silicon photonics that can be integrated in smartphones and other portable devices. Mid-IR chemical sensors operate in the spectral range of 2.5 to 12µm, and are considered the paradigm of innovative silicon-photonic devices.
6th February 2019


Partnership to decentralise cloud-to-edge AI

Partnership to decentralise cloud-to-edge AI
Leti, a research institute at CEA-Tech, has announced that its sensiNact Internet of Things (IoT) middleware will be the core of a platform under development in a EU-Korean project that will empower emerging Artificial Intelligence (AI) applications with on-demand computing at the edge of networks. 
31st October 2018

Multi-project wafer service with integrated silicon OxRAM

Multi-project wafer service with integrated silicon OxRAM
Research institute at CEA Tech, Leti, and CMP, a service organisation that provides prototyping and low volume production of ICs and MEMS, have announced the multi-project-wafer (MPW) process for fabricating emerging non-volatile memory OxRAM devices on a 200mm foundry base wafer platform.
2nd August 2018

Substrate innovation centre to develop engineered solutions

Substrate innovation centre to develop engineered solutions
It has been announced by Leti, that they have a new collaboration and five year partnership agreement, to drive the research and development of advanced engineered substrates, including SOI and beyond. This agreement brings the Leti-Soitec partnership to a new dimension and includes the launch of a prototyping hub associating equipment partners to pioneer with new materials. 
11th July 2018

International microfluidics group launched to write new standards

International microfluidics group launched to write new standards
  It has been announced by Leti, a research institute of CEA Tech, that new ISO standards on microfluidics will be developed under Leti’s initiative and guidelines.
15th June 2018

How microelectronics is fuelling innovation

Leti has announced its annual flagship event, Leti Innovation Days, 4th to 5th July in Grenoble. This year, the institute will address how microelectronics, Leti’s core activities, are empowering technological revolutions within industry, changing our daily lives in ways that will shape tomorrow’s global, post-modern society – in other words, how humans interact, commute, consume and much more.
11th June 2018

A path to creating building blocks of quantum processors

A path to creating building blocks of quantum processors
CEA-Leti has announced a breakthrough towards large-scale fabrication of quantum bits, or qubits, the elementary bricks of future quantum processors. They demonstrated on a 300 mm pre-industrial platform a new level of isotopic purification in a film deposited by chemical vapor deposition (CVD). This enables creating qubits in thin layers of silicon using a very high purity silicon isotope, 28Si, which produces a crystalline quality comparable to thin films usually made of natural silicon.
21st March 2018

Brain-inspired tech brings data processing to IoT devices

Brain-inspired tech brings data processing to IoT devices
A forward-looking call to action for the microelectronics industry has been issued by CEA-Leti’s chief scientist to create a radically new, digital-communication architecture for the Internet of Things in which “a great deal of analytics processing occurs at the edge and at the end devices instead of in the Cloud.”
16th February 2018

Kicking off ISSCC 2018 with an opening day keynote

Kicking off ISSCC 2018 with an opening day keynote
  Chief Scientist from Leti, Barbara De Salvo will help kick off ISSCC 2018 with an opening day presentation calling for radically new, digital-communication architecture for the Internet of Things in which 'a great deal of analytics processing occurs at the edge and at the end devices instead of in the Cloud'.
9th February 2018

SoC memory improvements highlighted at IEDM 2017

SoC memory improvements highlighted at IEDM 2017
A research institute of CEA Tech, Leti, demonstrated significant improvements in the field of memory systems at IEDM 2017. These improvements included reconfiguring Static Random-Access Memory (SRAM) into Content-Addressable Memory (CAM), improving non-volatile crossbar memories and using advanced Tunnel Field-Effect Transistors (TFET).
21st December 2017

The solution to stop drones from crashing has arrived

The solution to stop drones from crashing has arrived
  At the CES 2018 show in Las Vegas, Leti, research institute of CEA Tech, will demonstrate its low power, low cost 3D anti-crash, fusion-sensor solution for drones. Leti’s 360Fusion software, in combination with miniaturised sensors, collects, analyses and transforms millions of incoming 3D distance data items into relevant, actionable information.
18th December 2017

Micro-coolers for CERN particle detectors

Micro-coolers for CERN particle detectors
In order to pave the way for a revolutionary, new detector technique at the Large Hadron Collider at CERN, Leti has announced it has created a microfluidic circuit for cooling a particle detector.
11th December 2017

European FP7 project links the silicon photonic ecosystem

European FP7 project links the silicon photonic ecosystem
The European FP7 project PLAT4M has now been completed with results that exceeded expectations, according to Leti. Si photonics has long been expected to bring substantial breakthroughs in very high speed data communications, telecommunications and supercomputing. In addition, it is one of the most promising industrial-production candidates because of its potential for large-scale and low-cost production capability in existing CMOS foundries.
21st July 2017

Duo hoping to strengthen microelectronics innovation

Duo hoping to strengthen microelectronics innovation
Research institute of CEA Tech in Grenoble, France, Leti, and the Berlin-based Fraunhofer Group for Microelectronics, Europe's largest R&D provider of smart systems, will initially focus on extending CMOS and More-than-Moore technologies to enable next-gen components for applications in the Internet of Things, augmented reality, automotive, health, aeronautics and other sectors, as well as systems to support French and German industries.
29th June 2017

WVGA microdisplay for AR video on show at Display Week

WVGA microdisplay for AR video on show at Display Week
During Display Week in Los Angeles, 21st to 26th May, Leti will demonstrate what it claims to be the world’s first wide video graphic array (WVGA) GaN microdisplay with 10µ pixel pitch. The 10µ pixel pitch technology will help address the growing demand for augmented reality glasses for consumer and professional users, head-up displays for vehicle drivers and for pico projectors and other compact projectors. This prototype microdisplay, based on a self-emissive GaN-based technology, shows the highest resolution with smallest pixel pitch (10µm) ever presented.
24th May 2017

Backside shield protects microchips from physical attacks

Leti, a research institute of CEA Tech, announced it has developed a shield that can help protect electronic devices against physical attacks from the chips’ backside. ICs embedded in connected objects, smart cards or other systems dealing with sensitive data would benefit from this technology, which brings more privacy, safety and security to the users. Physical attacks may occur when hackers have access to the device and can exploit weaknesses of the embedded IC to steal sensitive information or to corrupt its functioning.
9th March 2017

Leti presents latest R&D results

In keeping with its mission to develop photolithography alternatives for advanced technology nodes and offer competitive solutions adapted to specific applications, Leti is developing technologies for directed self-assembly lithography (DSA), massively parallel electron beam lithography and nanoimprint lithography. Leti, a research institute at CEA Tech, will present its latest results in these approaches for fabricating advanced CMOS and silicon photonics devices and sensors in several papers at the SPIE Advanced Lithography conference in San Jose, Calif., Feb. 26-March 2.
23rd February 2017

Wearable device measures relaxation via alpha waves

Wearable device measures relaxation via alpha waves
Leti, an institute of CEA Tech, will demonstrate at CES 2017 a wearable device that takes measurement of brain-activity – alpha waves – out of the clinic and puts it into the hands of consumers. Using electroencephalography (EEG) to record the brain’s alpha-wave activity, the lightweight headgear called RELAX measures the level of alert relaxation with an embedded electrode system that does not require the sensors to be attached to the scalp.
13th December 2016


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