CEA / Leti
CEA / Leti Articles
FD-SOI breakthrough boosts operating frequency by 450%
CEA-Leti and Dolphin Design have developed an adaptive back-biasing (ABB) architecture for FD-SOI chips that can be seamlessly integrated in the digital design flow with industrial-grade qualification, overcoming integration drawbacks of existing ABB techniques.
RISE-6G: dynamically programmable wireless environments
CEA-Leti has announced a EU 6G research project for next-generation wireless connectivity. Called RISE-6G, it will design, prototype and test smart and energy-sustainable technological advances based on reconfigurable intelligent surfaces (RIS) that will enable programmable control and shaping of the wireless propagation environment.
High-performance gyroscope for automotive applications
CEA-Leti scientists, working with researchers at Politecnico di Milano, have developed the a high-performance gyroscope for operating in severe environments, such as industrial and aeronautic equipment and automobiles. The advancement has proven that it is possible to detect minute rotational movement even among system vibrations.
Machine-learning breakthrough opens way to the edge
CEA-Leti scientists have demonstrated a machine-learning technique exploiting what have been previously considered as ‘non-ideal’ traits of resistive-RAM (RRAM) devices, overcoming barriers to developing RRAM-based edge-learning systems.
In-memory computing pathways with 3D architectures
CEA-Leti presented two papers this week at IEDM 2020 that confirm the advantages of combining 3D architectures and resistive-random-access-memories (RRAM) for in-memory computing (IMC), and their applications for Edge-AI and neural networks.
Architecture for HPC devices using nanosheet fabrication
CEA-Leti has demonstrated a new gate-all-around (GAA) nanosheet fabrication device as an alternative to FinFET technology targeting high-performance (HPC) applications such as smartphones, laptops, and mobile systems with data collection and processing involving low-power and high-speed operation.
CEA-Leti LiFi using single GaN Blue MicroLED
CEA-Leti has announced its researchers have broken the throughput world record of 5.1 Gbps in visible light communications (VLC) using a single GaN blue micro- light-emitting diode (LED). Their data transmission rate of 7.7 Gbps achieved with a 10µm microLED marks another step toward commercialization and widespread use of LiFi communication.
Roadmap for 6th gen wireless networks in mmWave bands
As countries around the world begin rolling out 5G wireless networks, CEA-Leti is looking ahead to 6th gen wireless network technologies that will surpass the data-transfer capability of 5G.
Quantum integrated circuit with quantum dot on CMOS Chip
Leti, an institute of CEA, has created a quantum integrated circuit that demonstrates the possibility of integrating conventional electronic devices and elements with quantum dots on a CMOS chip.
Energy harvesting ICs for battery-free sensor
In scientists’ quest for ambient-energy sources that can power sensor nodes in remote environments or difficult-to-reach settings where batteries are impractical, CEA-Leti takes a wide view. It is investigating energy harvesting systems ranging from micrometre-and-millimetre scale to centimetre scale or larger.
Powerful positioning and navigation technology
Leti, a research institute of CEA Tech, and Orolia, a specialist in accuracy and performance for terrestrial, aeronautic and naval transportation positioning, navigation & timing applications, have announced a sensor-data-fusion engine that ensures resilient positioning and navigation even in cases of global navigation satellite system (GNSS) jamming or spoofing.
Smart-farm project to lower greenhouse gas emissions
Leti has announced a new European Commission smart-farming project that will deliver real-time data on soil conditions. Deployed via small, private Internet of Things networks, the SARMENTI sensor node will provide farmers with the next generation of a reagent-free sensor platform to monitor in real-time soil nutrient concentration and measure local environmental conditions, especially emission of ammonia and greenhouse gases.
Design innovative RF components for 5G networks
Leti, a research institute of CEA Tech, and Radiall, have announced a five-year common lab to design innovative antennas and radio frequency (RF) to meet infrastructure requirements of 5G networks and photonics components for harsh environments.
New HIV vaccine using lipid nanoparticle delivery technology
Leti, a research institute of CEA Tech, in collaboration with CEA’s Fundamental Research Divisionand INSERM, has developed a new vaccine approach for HIV based on engineered lipid nanoparticles that deliver p24 - a viral protein that is key to an HIV vaccine - and optimise the CpG adjuvant’s effect.
Edge-AI targeted with NVM memory cell
Researchers at CEA-Leti and Stanford University have reportedly developed a circuit integrating multiple-bit non-volatile memory (NVM) technology called Resistive RAM (RRAM) with silicon computing units, as well as new memory resiliency features that provide 2.3-times the capacity of existing RRAM.
Combined integrated optics and holography in AR technology
An institute of CEA-Tech, Leti, has developed a novel retinal-projection concept for augmented reality (AR) uses based on a combination of integrated optics and holography. The lens-free optical system uses disruptive technologies to overcome the limitations of existing AR glasses, such as limited field-of-view and bulky optical systems.
Mid-infrared optical sensors for portable devices
It has been announced by CEA-Leti that it has prototyped a next-generation optical chemical sensor using mid-infrared silicon photonics that can be integrated in smartphones and other portable devices. Mid-IR chemical sensors operate in the spectral range of 2.5 to 12µm, and are considered the paradigm of innovative silicon-photonic devices.
Partnership to decentralise cloud-to-edge AI
Leti, a research institute at CEA-Tech, has announced that its sensiNact Internet of Things (IoT) middleware will be the core of a platform under development in a EU-Korean project that will empower emerging Artificial Intelligence (AI) applications with on-demand computing at the edge of networks.
Project to improve reliability of electronic devices for autos
Leti has announced a project to improve reliability and response time of low cost automotive components by equipping the devices with sophisticated model predictive control techniques.
Multi-project wafer service with integrated silicon OxRAM
Research institute at CEA Tech, Leti, and CMP, a service organisation that provides prototyping and low volume production of ICs and MEMS, have announced the multi-project-wafer (MPW) process for fabricating emerging non-volatile memory OxRAM devices on a 200mm foundry base wafer platform.