Researchers at CEA-Leti and Stanford University have reportedly developed a circuit integrating multiple-bit non-volatile memory (NVM) technology called Resistive RAM (RRAM) with silicon computing units, as well as new memory resiliency features that provide 2.3-times the capacity of existing RRAM.

An institute of CEA-Tech, Leti, has developed a novel retinal-projection concept for augmented reality (AR) uses based on a combination of integrated optics and holography. The lens-free optical system uses disruptive technologies to overcome the limitations of existing AR glasses, such as limited field-of-view and bulky optical systems.

It has been announced by CEA-Leti that it has prototyped a next-generation optical chemical sensor using mid-infrared silicon photonics that can be integrated in smartphones and other portable devices. Mid-IR chemical sensors operate in the spectral range of 2.5 to 12µm, and are considered the paradigm of innovative silicon-photonic devices.

Leti, a research institute at CEA-Tech, has announced that its sensiNact Internet of Things (IoT) middleware will be the core of a platform under development in a EU-Korean project that will empower emerging Artificial Intelligence (AI) applications with on-demand computing at the edge of networks. 

  Leti has announced a project to improve reliability and response time of low cost automotive components by equipping the devices with sophisticated model predictive control techniques.

Research institute at CEA Tech, Leti, and CMP, a service organisation that provides prototyping and low volume production of ICs and MEMS, have announced the multi-project-wafer (MPW) process for fabricating emerging non-volatile memory OxRAM devices on a 200mm foundry base wafer platform.

It has been announced by Leti, that they have a new collaboration and five year partnership agreement, to drive the research and development of advanced engineered substrates, including SOI and beyond. This agreement brings the Leti-Soitec partnership to a new dimension and includes the launch of a prototyping hub associating equipment partners to pioneer with new materials. 

It has been announced by Leti, Transdev and IRT Nanoelec, that they are collaborating on a pilot program to characterise and assess LiDAR sensors to improve performance and safety of autonomous vehicles.

EuroCPS has supported over 30 European companies to create cyber-physical products for emerging IoT markets, while increasing their turnover and growing their teams. Coordinated by CEA Leti and funded by the European Commission, this three-year, €9.2m project helped innovators (at small/medium enterprises, or SMEs, and large companies) overcome the barriers they face when entering new markets.

Leti, a research institute of CEA Tech, has announced that field trials of its new Low Power Wide Area (LPWA) technology, a waveform tailored for Internet of Things (IoT) applications, showed significant performance gains in coverage, data-rate flexibility and power consumption compared to leading LPWA technologies. Leti’s LPWA approach includes its patented Turbo-FSK waveform, a flexible approach to the physical layer.

  It has been announced by Leti, a research institute of CEA Tech, that new ISO standards on microfluidics will be developed under Leti’s initiative and guidelines.

Leti has announced its annual flagship event, Leti Innovation Days, 4th to 5th July in Grenoble. This year, the institute will address how microelectronics, Leti’s core activities, are empowering technological revolutions within industry, changing our daily lives in ways that will shape tomorrow’s global, post-modern society – in other words, how humans interact, commute, consume and much more.

CEA-Leti has announced a breakthrough towards large-scale fabrication of quantum bits, or qubits, the elementary bricks of future quantum processors. They demonstrated on a 300 mm pre-industrial platform a new level of isotopic purification in a film deposited by chemical vapor deposition (CVD). This enables creating qubits in thin layers of silicon using a very high purity silicon isotope, 28Si, which produces a crystalline quality comparable to...

A forward-looking call to action for the microelectronics industry has been issued by CEA-Leti’s chief scientist to create a radically new, digital-communication architecture for the Internet of Things in which “a great deal of analytics processing occurs at the edge and at the end devices instead of in the Cloud.”

A research institute of CEA Tech, Leti, has announced that the European and South Korean project, 5GCHAMPION, will demonstrate the world’s first 5G platform from 20th to 22nd February, during the 2018 Winter Games. The 5GCHAMPION consortium, which includes 21 universities, research institutes and companies from Europe and South Korea, is supported by the European Commission and the Korean Ministry of Science and ICT.

  Chief Scientist from Leti, Barbara De Salvo will help kick off ISSCC 2018 with an opening day presentation calling for radically new, digital-communication architecture for the Internet of Things in which 'a great deal of analytics processing occurs at the edge and at the end devices instead of in the Cloud'.

  A research institute at CEA Tech, Leti, has invented a lens-free microscope technology that provides point-of-care diagnosis for spinal meningitis. Outlined in a paper presented at Photonics West, the new technology provides immediate results and eliminates errors in counting white blood cells (leukocytes) in cerebrospinal fluid, which is required to diagnose the infection.

A research institute of CEA Tech, Leti, demonstrated significant improvements in the field of memory systems at IEDM 2017. These improvements included reconfiguring Static Random-Access Memory (SRAM) into Content-Addressable Memory (CAM), improving non-volatile crossbar memories and using advanced Tunnel Field-Effect Transistors (TFET).

  At the CES 2018 show in Las Vegas, Leti, research institute of CEA Tech, will demonstrate its low power, low cost 3D anti-crash, fusion-sensor solution for drones. Leti’s 360Fusion software, in combination with miniaturised sensors, collects, analyses and transforms millions of incoming 3D distance data items into relevant, actionable information.

In order to pave the way for a revolutionary, new detector technique at the Large Hadron Collider at CERN, Leti has announced it has created a microfluidic circuit for cooling a particle detector.