Cadence Design Systems

  • Bagshot Road Bracknell Berkshire
    RG12 OPH
    United Kingdom
  • +44.1344.360333
  • + 44.1344.869647

Cadence Design Systems Articles

Displaying 1 - 20 of 526
27th April 2023
Cadence collaborates with GUC on AI, HPC and networking

Cadence has announced that the 112G-LR SerDes is silicon proven on the HBM3/GLink/CoWoS platform from Global Unichip Corp. (GUC).

26th April 2023
Cadence and TSMC collaborate on N16 79GHz mmWave design reference flow

Cadence has announced that it has collaborated with TSMC for the Cadence Virtuoso platform for the 79GHz mmWave design reference flow on TSMC’s N16 process.

25th April 2023
Cadence tapes out 16G UCIe advanced package IP on TSMC’s N3E process technology

Cadence Design Systems has announced the tapeout of Cadence 16G UCIe 2.5D advanced package IP on TSMC’s 3nm (N3E) process technology.

20th April 2023
Cadence unleashes the fFuture of analogue, custom and RFIC design

Cadence has announced the new Cadence Virtuoso Studio, a next-gen custom design platform that delivers an optimal design experience and ushers in the future for custom analogue design.

18th April 2023
Cadence introduces EMX Designer delivering 10x increased performance

Cadence Design Systems announced the Cadence EMX Designer, a passive device synthesis and optimisation technology that delivers, in split seconds, design rule check (DRC)-clean parametric cells (PCells) and accurate electromagnetic (EM) models of passive devices, such as inductors, transformers and T-coils.

18th April 2023
Cadence demonstrates interoperability with SK hynix’s LPDDR5T Mobile DRAM

Cadence Design Systems has announced that it has demonstrated interoperability between the silicon-proven Cadence LPDDR5X memory interface IP and SK hynix’s LPDDR5T (Turbo) mobile DRAM, operating at speeds in excess of the LPDDR5X standard.

Artificial Intelligence
11th April 2023
Allegro X AI, accelerating PCB design

Cadence Design Systems has announced the Cadence Allegro X AI technology, a next-generation system design technology that offers revolutionary improvements in performance and automation.

9th March 2023
Cadence to invest $50 million to support racial equity

Cadence has announced that it is making a $50 million purpose-driven investment in an impact investment program managed by RBC Global Asset Management (RBC GAM) to address racial wealth inequities in affordable housing, homeownership and small business.

17th February 2023
Cadence delivers 13 new VIPs and expands system portfolio

Cadence Design Systems has announced the availability of 13 new Verification IP (VIP) solutions that enable engineers to quickly and effectively verify their designs to meet the specifications for the latest standards protocols.

Artificial Intelligence
19th January 2023
GUC delivers TSMC N3 chip and AI-optimised N5 design

Using Innovus Implementation, GUC delivered a 3.16GHz HPC core design with 3.5M instances on the TSMC N3 process technology. GUC realised a 9% area shrink and an 8% reduction in power consumption on a CPU design on the TSMC N5 process using the AI-enabled Cadence Cerebrus.

11th January 2023
Cadence announces 8533Mbps LPDDR5X IP solution

Cadence announced the LPDDR5X memory interface IP design optimsed to operate at 8533Mbps—up to 33% faster than the previous generation of LPDDR IP.

6th January 2023
Cadence Tensilica HiFi DSP enables energy-efficient playback for Dolby Atmos

Cadence has announced that Cadence Tensilica HiFi DSP IP supports Dolby Atmos for cars making it the first DSP IP with this capability.

20th October 2022
Cadence and Samsung Foundry collab to boost 3D-IC design

Cadence Design Systems, a collaborative partner in the Samsung Advanced Foundry Ecosystem (SAFE), has announced that it has expanded its collaboration with Samsung Foundry to accelerate 3D-IC (three-dimension integrated circuit) design.

12th October 2022
Cadence Certus delivers fast concurrent full-chip optimisation and signoff

Cadence Design Systems has announced the Cadence Certus Closure Solution to address growing chip-level design size and complexity challenges.

6th October 2022
Cadence Voltus-XFi custom power integrity for 5LPE process technology

Cadence Design Systems has announced that the Cadence Voltus-XFi Custom Power Integrity solution is optimised and certified for use with Samsung Foundry’s advanced 5LPE process technology.

5th October 2022
Collaboration to certify RFIC design reference flow on 8nm process technology

Cadence Design Systems announces that Samsung Foundry has certified an 8nm RFIC design reference flow to develop 5G RFICs for use with sub-6GHz to millimeter wave (mmWave) applications.

Tech Videos
3rd October 2022
Cadence at European Microwave Week 2022

Mick Elliott, Editor at Electronic Specifier, visited the Cadence Design Systems stand at European Microwave Week where Senior Product Marketing Manager David Vye described the latest developments in RF and microwave design tools.

Artificial Intelligence
14th September 2022
Cadence Joint Enterprise Data and AI platform accelerates AI-driven chip design development

Cadence Design Systems has announced the delivery of the Cadence Joint Enterprise Data and AI (JedAI) Platform.

5th August 2022
Cadence library characterisation solution accelerates delivery

Cadence Design Systems has announced that Arm is leveraging Cadence Liberate MX Trio Characterization to enhance the quality of its embedded memory instances and compilers and speed time to market.

27th July 2022
Analogue & mixed-signal IP: Spectre FX Simulator

Cadence Design Systems has announced that Samsung Foundry has deployed the Cadence Spectre FX Simulator for FastSPICE-based verification of their large-scale analogue and mixed-signal IP on 3nm, 4nm and 5nm processes.

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