Advantest has introduced its new T2000 8GDM to address the test requirements of system-on-chip devices with high-speed serial, parallel and memory interfaces such as PCI-Express and double data rate connections. The new module will be featured in Advantest’s exhibit (booth #8C-901 in Hall 8) at the SEMICON Japan trade show, December 5-7 in Makuhari Messe in the Chiba prefecture.

Advantest Corporation has introduced its new Multi-Vision Metrology Scanning Electron Microscope, the Wafer MVM-SEM E3310, which measures fine-pitch patterns on a wide range of wafer types with unparalleled accuracy, utilizing Advantest’s proprietary electron beam scanning technology.

Advantest has announced that it has developed a new EB (electron beam) lithography system, the F7000, with superior resolution performance meeting the requirements for 1Xnm technology nodes. The F7000 supports substrates of diverse materials, sizes, and shapes, including nanoimprint templates as well as wafers, and is optimized for diverse applications such as advanced LSIs, photonics, MEMS, and other nano-processes.

Advantest has introduced its new T2000 Integrated Massive Parallel test solution (IMS), a massive parallel test system capable of achieving the lowest cost of test for microcontroller units with integrated analog and embedded flash memory circuits.

Premier fournisseur de bancs de test pour semiconducteurs, Advantest Corporation s'est vue décerner le Prix du Meilleur Fournisseur par la société STATS ChipPAC Ltd. (SGX-ST : STATSChP), l'un des premiers prestataires en solutions d'emballage, d'assemblage, de tests et de distribution de semiconducteurs. C’est la cinquième année consécutive qu’Advantest est distinguée par cette reconnaissance.

Advantest has announced today that it has installed its 500th V93000 Port Scale RF test system, with the landmark unit going into the engineering development laboratory of Spreadtrum Communications. Spreadtrum has begun using the versatile tester, which is equipped with both a Pin Scale 1600 digital card and a MB-AV8+ analog card, to develop semiconductor products for mobile phone applications, including RF-based system-on-chip and 3G baseband de...

Advantest has today announced that it has received a Best Supplier Award from Singapore-based STATS ChipPAC. This is the fifth consecutive year that Advantest has earned this supplier accolade. STATS ChipPAC’s Best Supplier Award recognizes materials and equipment suppliers for overall best-in-class performance in cost, quality, delivery, technology, service and support.

Advantest Corporation declared today that the company received the Best Overall Presentation Award at the 22nd Annual IEEE Semiconductor Wafer Test Workshop for a joint presentation with leading probe card manufacturer JEM. SWTW 2012 was held June 10 - 13, 2012, in San Diego, CA, USA.

Advantest Corporation have introduced the new T2000 LJC16 16-channel, low-jitter-clock module. The LJC16 module, which combines different digital clock and analog clock/sine-wave requirements in a single high-multi-site system, will be featured in Advantest’s booth (#6247 in North Hall) at the SEMICON West trade show, July 10-12 in San Francisco.

Advantest today announced that its South Korean subsidiary, Advantest Korea broke ground on June 28 for its new factory in Cheonan City, Chungnam Province, South Korea.

Shanghai Hua Hong NEC Electronics Company, Ltd. and Advantest Corporation have collaborated to successfully develop a wafer-level, multi-site parallel test solution for radio-frequency identification semiconductor devices that meet industry-standard ISO 14443 guidelines.

Advantest Corporation today announced that a new product line of fully automated and integrated test and handling solutions for TSV based 2.5D and 3D products is under development. The concept model test cell dubbed, DIMENSION, integrates a high parallel test cluster along with singulated die and 3D die stack automated handling capabilities.

Advantest Corporation today announced its new memory test system, the T5811, targeting DRAM memory core test. Available from July 2012, the T5811 reduces power consumption by 90% and floor-space requirements by two-thirds, compared to previous models, and is upgradable via a simple exchange of components.

Advantest Corporation today announced that it will launch a new test solution, dubbed CloudTesting Service (CTS), which utilizes cloud computing technology to offer cutting-edge test technology for semiconductor device R&D and design applications.

Just ten months after launching its Smart Scale generation of testers, Advantest Corporation has shipped its 100th V93000 Smart Scale system, capable of scalable, highly cost-efficient testing of IC designs for the 28 nm technology node and beyond.

Advantest Corporation today announced that its quadrennial corporate exhibition, Advantest Expo 2012, will be held at the Tokyo International Forum on June 6th—7th, 2012. The event will showcase Advantest’s present and future with numerous tools and equipment displays, as well as keynote speeches and seminars exploring the diverse sectors where Advantest has a presence. Attendance is expected to include the general public as well as industry ...

Advantest Corporation announced the availability of its next-generation high-speed DRAM test system, the T5511. The new system, which begins shipping this month, offers the industry’s fastest test speed of 8Gbps.