Cables/Connecting

Cable assemblies for defence and aerospace applications

19th February 2014
Nat Bowers
0

Suitable for defence and aerospace applications, Molex announces its Ruggedised Backplane Cable Assemblies. These cable assemblies have been designed for defence and aerospace contractors looking to deliver high-speed data transfer between commercial backplanes or servers, to COTS connectors including Impact, Impel, VHDM or full military-qualified interfaces.

Designed to mate to a large variety of ruggedised connectors, the customised backplane cables have gone through extensive engineering testing to ensure that they meet their respective application-specified data rates and performance requirements. Additionally, they feature a blind mate capability which allows for misalignment and provides a "float" between mating surfaces.

Offering data throughput ranges of 2-25Gbps (configuration dependent), the assemblies reduce high transmission losses caused by long trace lengths on circuit boards. A solid connection in shock or vibration situations is ensured with a positive latch feature, which also offers an intuitive squeeze-and-pull mechanism for ease of use. The Ruggedised Backplane Cable Assemblies are available with optional metal backshells to provide 360˚ EMI shielding and reduce crosstalk at the mating interface for improved system performance.

“Expanding communication capabilities and data processing speeds through state-of-the art technology is a fundamental goal for the U.S. Department of Defense and aerospace contractors. But, these customers want to be able to increase the data rates without incurring the high cost of re-designing their systems with an optical solution. Our Ruggedized Backplane Cable Assemblies solve this challenge by not only increasing data rates between the server and rugged input/output connectors, but also by offering multiple interconnect options and performance ranges all with a rugged and reliable construction,” commented Mark Joseph, Business Development Manager, Molex.

Product Spotlight

Upcoming Events

View all events
Newsletter
Latest global electronics news
© Copyright 2024 Electronic Specifier