USB 2.0 Molex HandyLink I/O interconnect system available now from TTI

TTI has introduced the Molex HandyLink System. The 3-way HandyLink product family includes a right-angle SMT receptacle, a wire and PCB version of the plug, perpendicular and parallel mounted cradle connectors for docking applications and a wide array of cable assemblies and accessories including full turn-key cradle design, assembly and pack-out capability.

The innovative compression-style contact design provides long-term performance and reliability with 20,000 mating cycles. The SMT receptacle and cradle connectors are Lead-free process compatible. The HandyLink™ family’s current-carrying capability of 1.5A continuous (up to 3.0A depending on circuit configuration) and compact size provide an optimal solution for the mobile device industry. The patented integrated-latch design provides ESD protection and mechanical integrity.

Whether you are looking for a wire-to-board solution or a board-to-board docking solution for your hand held device the HandyLink connector interface is the perfect choice. Applications such as PDA, mobile audio and video equipment, cellular phones and personal medical devices are matched by diagnostic devices, barcode readers and point-of-sale terminals.

Keep Up to Date with the Most Important News

By pressing the Subscribe button, you confirm that you have read and are agreeing to our Privacy Policy and Terms of Use
Previous Post

Non-Metallic enclosures for a range of tough environments

Next Post

Ericsson wins Elektra Clean Design award in recognition of its leadership in environmental performance