A compact 1.25 x 2.00 x 0.335in (31.7 x 50.8 x 8.50 mm) SIP package minimizes impedance to system airflow, thus enhancing cooling for both upstream and downstream devices. The use of automation for assembly, coupled with advanced power electronics and thermal design, facilitates a 23 million hour MTBF.
Compliances include RoHS, UL94V-0 flammability, and UL60950. Certification to IEC/EN60950 is pending. Pricing is $19.00 each in quantities of 1000. Samples are usually available from stock. Production quantities are typically available in six to eight weeks.