This allows for reduced head-in-pillow (HiP) defects and improved graping performance. It also exhibits exceptional stencil printing, especially for small components (01005) and fast printing speeds (>125 mm/sec).
Indium10.8HF solder paste is part of Indium Corporation’s family of high-performance, lead-free, low-voiding, no-clean solder pastes that help manufacturers Avoid the Void™.