Indium Corp has specifically formulated Indium10.1 and Indium8.9HF solder pastes to reduce voiding significantly below the industry average for improved finished goods reliability. Halogen-free Indium8.9HF solder paste has a unique oxidation barrier technology that makes it perfectly suited for a variety of applications, especially automotive assembly.
In addition to outstanding print transfer and excellent response-to-pause, Indium10.1 and Indium8.9HF both provide excellent pin-in-paste solderability and hole-fill. Indium10.1 and Indium8.9HF are part of Indium Corporation’s family of high-performance, lead-free, low-voiding, no-clean solder pastes.