This latest module is designed to meet the growing demands of IoT applications, with advanced connectivity options and a compact form factor.
It is powered by Silicon Labs’ ultra-low-power EFR32MG21 wireless SoC, and supports Zigbee 3.0 and BLE 5.3, allowing multi-protocol coexistence for enhanced communication capabilities. It is powered by an ARM Cortex-M33 processor with a frequency of up to 80MHz, ensuring efficient performance for a broad range of applications. The module offers flexible memory configurations to suit various applications, with options of 64KB RAM and 768KB flash memory, or 96KB SRAM and 1024 KB flash memory, providing ample resources for developers to create robust solutions.
A significant feature of the KCMA32S is its support for Zigbee/BLE mesh networking, which subsequently increases network scalability and node counts with mesh topology. This capability is especially important for devices that enable many-to-many communications such as smart lighting, smart buildings, and smart home wireless networks. Furthermore, it offers an enhanced security option, Secure Vault.
“With the launch of the KCMA32S, we’re expanding the possibilities for compact, high-performance IoT solutions,” remarked Delbert Sun, Vice General Manager, Product Division, Quectel Wireless Solutions. “This module brings together robust multi-protocol connectivity, advanced security features, and a compact form factor, empowering developers to create smarter, more scalable IoT devices across industries like smart lighting, building automation, and consumer electronics.”
With its ultra-compact size of 20mm × 12mm × 2.2mm, the KCMA32S is designed in a LCC + LGA form factor, optimising both size and cost for end-products. This versatility allows for compatibility with diverse designs, making it a well suited choice for various IoT applications.
The KCMA32S supports up to 20 GPIOs, which can be multiplexed for various interfaces, including I2C, UART, SPI, and I2S, in the QuecOpen SDK solution. It also features superior sensitivity of -104 dBm and a transmit power of up to +20 dBm, providing flexibility and versatility for a range of applications.
Key features:
- Zigbee 3.0 and BLE 5.3 support with multi-protocol coexistence
- 64 KB RAM and 768 KB flash memory or 96 KB SRAM and 1024 KB flash memory (optional)
- Zigbee/BLE mesh networking capabilities
- 20 GPIOs for multiplexed interfaces including I2C, UART, SPI, and I2S functions in QuecOpen solution
- Operating temperature range of -40 °C to +85 °C
- Optional PCB antenna/RF coaxial connector/pin antenna interface
