Adeia’s reworkable die-to-wafer hybrid bonding has been shortlisted for the Electronics Excellence Awards under the Semiconductor category.
Adeia’s reworkable die-to-wafer (D2W) hybrid bonding processes make it possible to remove and replace defective die after hybrid bonding, addressing one of the technology’s most critical pain points. The approach exploits a key insight: immediately after bonding, before anneal, the interface is held mainly by weak hydrogen bonds. Within this window, optical inspection techniques detect voids or misalignment, and defective or misaligned die are removed using one of two demonstrated methods, a blade-based lift or an adhesive stud pull. Sites are then cleaned, reactivated, and rebonded with fresh die using standard processes. Rebonded sites achieve 97–98% electrical yield, matching first-bond yield, so a single defect no longer forces manufacturers to scrap an entire high-value assembly, including already bonded known-good die.
As AI models grow more complex and data-intensive, semiconductor design is being pushed beyond the practical limits of traditional packaging. Chipmakers such as AMD and NVIDIA need more memory bandwidth, lower power, and better thermal performance, all at once. That is where hybrid bonding comes in. By creating direct dielectric-to-dielectric and copper-to-copper bonds between two surfaces, hybrid bonding supports interconnect pitches below one micron, far beyond the 20-35 micron limit of microbumps. This delivers lower capacitance and resistance, lower power per bit transferred, better thermal dissipation, improved reliability, and smaller form factors.
For more information, visit: https://adeia.com/semiconductor/technology
The Electronics Excellence Awards ceremony will take place at electronica on Tuesday 10th November at 12.30pm at the Hall C6 stage.
You’re all welcome to come and see which product will win!
