Using an advanced 48V high power density Gallium Nitride (GaN) semiconductor process optimized for high peak-to-average ratio applications, these high performance amplifiers achieve high efficiency and flat gain over a broad frequency range in a single amplifier design. The RFG1M series are input-matched GaN transistors packaged in an air cavity ceramic package, which provides excellent thermal stability. Ease of integration is accomplished through the incorporation of simple, optimized matching networks external to the package that provide wideband gain, efficiency, and potential high linearity performance in a single amplifier.
Features
Advanced GaN HEMT technology
High peak modulated power: RFG1M09090 >120W, RFG1M09180 >240W,
RFG1M20090 >90W, RFG1M20180 >180W
Advanced heat sink technology
-25°C to 85°C operating temperature
Optimized for video bandwidth and minimized memory effects
RF-tested for 3GPP performance
RF-tested for peak power using IS95
Large signal models available
Applications
Commercial wireless infrastructure
High efficiency doherty
High efficiency envelope tracking
Military communications