Organized by a group of industry leaders, the event provided valuable insight about solving cleaning challenges and improving yields for 30 Montreal engineers. Four powerful presentations were given by industry experts including:
“Fine Solder Pastes: Stencil Printing and Reflow in Lead-Assembly,” by Ed Briggs, Indium Corporation
“Nano Coatings,” by Kon Akbar, Stentech
“Process/Profiling and Environmental Issues and Concerns,” by Don DeAngelo, Heller Industries
“Causes, Effects and Solutions for White Residue Formation,” by Debbie Carboni, Kyzen
The presentations were followed by an informational Q&A session. Customers came to the technology day looking for answers and that is exactly what was delivered. One attendee commented, “Our company walked away with a couple of key points that will help us resolve challenges and improve yields.”