The one-day seminar comprises seven technical presentations including: Joining & Packaging Technology for High Temperature Electronics, Ultrasonically Bonded Copper Interconnects, Press-fit Connections For High Reliability & Automotive Applications, End-Of-Life Options For Electronic Interconnects, Innovative Adhesive Technologies, Bonding With Nanotechnology and a keynote presentation from the IeMRC, which addresses The Benefits, Challenges & Opportunities For Solder-free Connections.
IMAPS-UK “Beyond Solder” Technical Programme Released
IMAPS-UK has released details of the Technical Programme for their forthcoming “Beyond Solder” Technical Seminar being held on at the National Physical Laboratory, London on the 30 June 2010.
With its theme of interconnect processes, technology and materials, the event has attracted leading presenters from Companies and Institutions such as IeMRC, Henkel, TWI, Kulicke & Soffa, Panda Europe, NPL & Irisys.
