’ SE500-D™ Dual Lane SPI system is designed with largest board handling capability comparable with major SMT suppliers. With its flexible conveyor configuration, SE500-D™ maximizes production utilization by allowing different products with varying board widths to be run on the same production line. SE500-D™ also supports asynchronous inspection on separate lanes.
Also on display, CyberOptics will highlight its simple yet robust 100 percent 3D SPI system ― the SE350™. CyberOptics’ calibration-free sensing technology is at the heart of its SPI product suite, delivering a flexible inspection solution that can inspect even the most demanding assemblies at 80 cm²/second inspection speeds or greater, without compromising on measurement accuracy and repeatability.
MX500™ offers scalability and flexibility for line expansion using an innovative multi-lane approach. It is designed with a horizontal-stackable conveyor system with a primary inspection lane that can be coupled with additional lanes to support dual, triple and quad-lane configurations. It includes CyberOptics’ core inspection sensor design (SIM) and inspection engine (SAM), delivering a high-speed, flexible inspection solution for advanced inspection of solder and lead defects, presence and position, correct parts, and polarity down to 01005 components.
CyberOptics’ innovative, multi-award winning QX500™ AOI system that provides ‘on-the-fly’ area-scanning inspection at an incredible 200 cm²/sec also will be on display at the show,