Industry’s highest resolution OIS IC for smartphone cameras

11th November 2013

onsemi

Nat Bowers

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Datasheet

The industry’s highest resolution optical image stabilization integrated circuit for use in smartphone camera modules has been announced by ON Semiconductor. Offering industry-leading accuracy and low power operation in a compact size, the highly integrated LC898111AXB-MH solution combines both the controller and driver functionality necessary for dealing with OIS in the camera modules incorporated into smartphone handsets.

Enabling precise suppression control of camera shaking, the LC898111AXB-MH features a significantly increased shutter speed leading to exposure compensation far superior to competing OIS solutions. Allowing the implementation of Pan/Tilt functions which are indispensable for walk-and-take situations, the new optical image stabilization IC is program-ready. Reducing overall power consumption and board real estate utilisation, this enables it to minimize the number of external components necessary in the system design. The output of the IC’s integrated PWM driver lowers power consumption and reduces the effect of noise on image quality.

Tomofumi Watanabe, business unit Leader of the Power Solutions Products in Intelligent Power Solution Division at ON Semiconductor, comments: "There is growing demand for enhanced camera performance in the latest smartphone models... Handset manufacturers need to specify higher resolution CMOS image sensors that are supported by greater degrees of OIS accuracy. The innovative LC898111AXB-MH IC has already been adopted by leading smartphone manufacturers and is currently in use in the highest resolution smartphone camera on the market today.”

Featuring numerous built-in digital and analog signal processing mechanisms, the LC898111AXB-MH includes a two-channel position sensing circuit, a gyro-filter interface circuit and lens-servo circuit. The position sensing circuit contains a hall-amp circuit, constant current digital-to-analog converter, gain control operational amplifier and 12-bit analog-to-digital converters for each channel. The gyro-filter interface circuit is fully compatible in both analog and digital signals. Allowing comprehensive configuration when connecting with various gyros and actuators, the gyro-filter interface and the lens-servo circuits are adjustable through the I²C and SPI bus interfaces. Therefore, the device can cover a wider shaking frequency range and offers a more expansive image stabilization angle.

Further expansion of the series is planned with the LC898119XC-MH, offering the industry’s smallest chip size measuring 2.0 mm x 2.0 mm x 0.675 mm, while providing extremely low power consumption. Samples are available now.

Offered in a compact, lead-free/halogen-free P48-pin WLP package measuring 2.57 mm x 3.22 mm x 0.69 mm, the LC898111AXB-MH is priced at $2.30 (USD) each in 4,000 unit quantities.