This June, Electronic Specifier’s Associate Editor, Sheryl Miles, takes a look at the top 5 power products released in June 2026.
240W GaN desktop adapter simplify medical & industrial integration
XP Power introduces the APM240 series of 240W external desktop AC-DC power supplies that simplify integration in medical, home healthcare, and industrial applications. The adapters are designed for engineers developing patient treatment, patient monitoring, and surgical robots, as well as industrial robotics and process control equipment. The series combines high power density, global compliance, and high energy efficiency in a compact, easy-to-deploy format. (Read more.)
Littelfuse NANO² series fuse for AI data centre protection
Littelfuse has announced the NANO2 surface-mount 708 series fuse, the first Littelfuse surface-mount fuse offering a 14000A interrupting rating at 80V DC.
Engineered for next-generation 48V DC power architectures, the 708 series addresses the growing protection demands of AI servers, hyperscale data centres, and high-density power distribution systems. As power levels rise and board space shrinks, designers have been forced to rely on oversized, manually installed through-hole or bolt-down fuses. The 708 series provides a compact, automation-friendly alternative without compromising performance. (Read more.)
40V N-channel power MOSFETs in SOP advance(EWF) package
Toshiba Electronics Europe announces the launch of three new 40V N-channel power MOSFETs: the XPMR5904PB available now, and the XPMR7404PB and XPMR8504PB, which will become available shortly. These devices use the newly adopted SOP Advance(EWF) package and are designed for demanding automotive applications, including inverters, semiconductor relays, load switches, and motor drives. (Read more.)
ROHM launches new top-side cooling package for SiC MOSFETs
ROHM has developed the TSC3PAK (14.00 x 18.58 x 3.50mm) package for SiC MOSFETs. By adopting a top-side heat dissipation structure that places the heat dissipation surface on the top of the package, the new product enables automated mounting while achieving heat dissipation performance comparable to that of conventional through-hole packages (TO-247-4L). This contributes to greater efficiency and reliability in power conversion circuits for onboard chargers (OBCs) and electric compressors used in xEVs (electric vehicles). (Read more.)
Rutronik advances power electronics with new RAK-GaN
With the new RAK-GaN application kit, Rutronik expands its solutions portfolio in the field of advanced power electronics and reinforces its position as a development partner for future-oriented systems. The compact evaluation platform enables customers to efficiently test, validate, and optimise GaN-based motor control and power conversion concepts. By combining powerful microcontroller technology with innovative GaN semiconductors, the RAK-GaN provides a practical development environment for applications where efficiency, power density, and system integration are key. (Read more.)
For more power product news, and the latest on the electronics industry, check out the other articles on the website.
