Redefining Point of Load regulation for demanding XPUs
With previous unattainable performance levels for high current applications Vicor technology has developed Artificial Intelligence (AI) processors and 48V autonomous driving systems. High performance computers and large scale datacenters will be taken to the next level by Vicor modules delivering hundreds of amps of steady power.
The new technology, Power-on-Package, gives the following advantages:
- External high current delivery through the ‘last inch’
- Higher peak and average current delivery
- Reduced motherboard copper and XPU socket interconnect resistances by >10X
In response to the ever-increasing demands of high performance applications – artificial intelligence, machine learning, big data mining – XPU operating currents have risen to hundreds of Amperes. Point-of-Load power architectures in which high current power delivery units are placed close to the XPU mitigate power distribution losses on the motherboard but do nothing to lessen interconnect challenges between the XPU and the motherboard.
With increasing XPU currents, the remaining short distance to the XPU – the ‘last inch’ – consisting of motherboard conductors and interconnects within the XPU socket has become a limiting factor in XPU performance and total system efficiency.
The new Vicor Power-on-Package Modular Current Multipliers (MCMs) fit within the XPU package to expand upon the efficiency, density, and bandwidth advantages of Vicor Factorised Power Architecture, already established in 48V Direct-to-XPU motherboard applications by early adopters.
Product Spotlight
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Panasonic
Panasonic PhotoMOS® Photovoltaic MOSFET High-Power Drivers
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| Stock: | 3490 |
| Cost: | $3.95 |
