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Power Switches in SC-75 Packaging Lower Thermal Resistance in Portable Applications

7th November 2007

ES Admin

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Fairchild Semiconductor has released the FDMJ1023PZ and the FDFMJ2P023Z MicroFET power switches for low power (<30V) applications such as charging, asynchronous DC/DC and load switching. These power switches operate with gate voltages as low as 1.5V while offering 75 percent lower RDS(ON) and 66 percent lower thermal resistance compared to other solutions. Utilizing Fairchild’s advanced PowerTrench technology, the FDMJ1023PZ and FDFMJ2P023Z are housed in 2.0mm x 1.6mm SC-75 packaging, which is 65% smaller than 3 X 3mm SSOT-6 and 20% smaller than SC-70 packaging.

The advantage of these 2.0mm x 1.6mm MicroFET power switches is that they can deliver equivalent thermal and electrical performance of power switches packaged in 3mm X 3mm SSOT-6 packaging. Optimal performance in an ultra-compact package is pivotal for portable applications such as cell phones, digital cameras and games where more and more functions are packed into smaller and smaller PCB space. These applications can also benefit from their guaranteed operation down to 1.5V.

Fairchild Semiconductor offers the industry’s broadest portfolio of thermally enhanced ultra-compact, low-profile devices targeting low-power applications. These easy-to-implement, high-performance and space-saving MOSFETs are ideal for all of our customers’ low-voltage switching and power management/battery charging systems.

The FDMJ1023PZ and FDFMJ2P023Z utilize lead-free (Pb-free) terminals and have been characterized for moisture sensitivity in accordance with the Pb-free reflow requirements of the joint IPC/JEDEC standard J-STD-020. All of Fairchild's products are designed to meet the requirements of the European Union's Directive on the restriction of the use of certain substances (RoHS).