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Speed up SiC MOSFET development with X-FAB XbloX

Speed up SiC MOSFET development with X-FAB XbloX

Speed up SiC MOSFET development with X-FAB XbloX

Power

29 April 2026

Quantifying comfort and fit in wearable devices

Quantifying comfort and fit in wearable devices

Quantifying comfort and fit in wearable devices

29 April 2026

NMITE secures IET accreditation for its engineering degrees

NMITE secures IET accreditation for its engineering degrees

NMITE secures IET accreditation for its engineering degrees

29 April 2026

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Trending Now

Speed up SiC MOSFET development with X-FAB XbloX

Speed up SiC MOSFET development with X-FAB XbloX

Speed up SiC MOSFET development with X-FAB XbloX

Power

29 April 2026

Quantifying comfort and fit in wearable devices

Quantifying comfort and fit in wearable devices

Quantifying comfort and fit in wearable devices

29 April 2026

NMITE secures IET accreditation for its engineering degrees

NMITE secures IET accreditation for its engineering degrees

NMITE secures IET accreditation for its engineering degrees

29 April 2026

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Advanced motor drivers land at Mouser

Advanced motor drivers land at Mouser

Advanced motor drivers land at Mouser

5 January 2026

Top 5 power products in December

31 December 2025

DC/DC converter enables enhanced EMI performance

DC/DC converter enables enhanced EMI performance

DC/DC converter enables enhanced EMI performance

Power

22 December 2025

Researchers at Chonnam National University have proposed a new way to control power factor correction circuits that could make everyday electronics smaller, cheaper, and more reliable, by removing the need for current sensors.

Researchers at Chonnam National University have proposed a new way to control power factor correction circuits that could make everyday electronics smaller, cheaper, and more reliable, by removing the need for current sensors.

Sensorless power control promises smaller, cheaper chargers for consumer electronics

Power

19 December 2025

Fast and very fast performance thin film chip fuses

Fast and very fast performance thin film chip fuses

Thin film chip fuses with very fast acting performance

Power

18 December 2025

ROHM has launched two new motor driver integrated circuits aimed at broadening the range of applications for brushed DC motors in consumer and industrial equipment, as manufacturers seek greater energy efficiency and design flexibility.

ROHM has launched two new motor driver integrated circuits aimed at broadening the range of applications for brushed DC motors in consumer and industrial equipment, as manufacturers seek greater energy efficiency and design flexibility.

ROHM unveils flexible DC motor driver chips to target energy-efficient appliances

Power

18 December 2025

Inductive components with high frequency stability for railway

Inductive components with high frequency stability for railway

Stable high frequency inductive components for railway applications

18 December 2025

Helping engineers transition from 12V to 48V power distribution

Helping engineers transition from 12V to 48V power distribution

Helping engineers transition from 12V to 48V power distribution

16 December 2025

IDTechEx assesses the current status of 800V for EVs

IDTechEx assesses the current status of 800V for EVs

IDTechEx assesses the current status of 800V for EVs

15 December 2025

onsemi & FORVIA HELLA extend collaboration with power tech

onsemi & FORVIA HELLA extend collaboration with power tech

onsemi & FORVIA HELLA extend collaboration with power tech

12 December 2025

Infineon extends CoolSiC MOSFET 750V G2 family

Infineon extends CoolSiC MOSFET 750V G2 family

Infineon extends CoolSiC MOSFET 750V G2 family

Power

11 December 2025

SemiQ launches third gen QSiC MOSFETs

SemiQ launches third gen QSiC MOSFETs

SemiQ launches third gen QSiC MOSFETs

Power

11 December 2025

GaN RF power transistors meet demanding applications

GaN RF power transistors meet demanding applications

GaN RF power transistors meet demanding applications

Power

9 December 2025

Navitas Semiconductor Corporation have announced a strategic long-term partnership intended to advance the adoption of GaN technology in India

Navitas Semiconductor Corporation have announced a strategic long-term partnership intended to advance the adoption of GaN technology in India

Navitas, Cyient Semiconductors accelerate GaN adoption in Indian markets

8 December 2025

Vector has integrated its vCharM charging and load management platform with OPTENDA’s Energy Monitor in a move aimed at curbing load peaks and sharpening energy analysis across electric-vehicle charging infrastructure. The combined system, already deployed at Vector’s sites in Stuttgart, Karlsruhe, and Regensburg, is now being offered to third-party operators.

Vector has integrated its vCharM charging and load management platform with OPTENDA’s Energy Monitor in a move aimed at curbing load peaks and sharpening energy analysis across electric-vehicle charging infrastructure. The combined system, already deployed at Vector’s sites in Stuttgart, Karlsruhe, and Regensburg, is now being offered to third-party operators.

Vector links EV charging platform to OPTENDA energy monitor in bid to cut electricity costs

Power

8 December 2025

X-FAB XbloX accelerates time-to-market for scalable, SiC MOSFET solutions

X-FAB XbloX accelerates time-to-market for scalable, SiC MOSFET solutions

X-FAB XbloX accelerates time-to-market for scalable, SiC MOSFET solutions

Power

6 December 2025

Infineon enhances Electreon's electric road charging

Infineon enhances Electreon's electric road charging

Infineon enhances Electreon’s electric road charging with silicon carbide technology

Power

6 December 2025

ROHM has begun mass production of a new series of silicon-carbide MOSFETs that it claims will allow manufacturers to shrink power systems while increasing their output, as demand rises for compact, high-density hardware used in AI servers and renewable-energy equipment.

ROHM has begun mass production of a new series of silicon-carbide MOSFETs that it claims will allow manufacturers to shrink power systems while increasing their output, as demand rises for compact, high-density hardware used in AI servers and renewable-energy equipment.

ROHM unveils SiC MOSFETs in compact TOLL package as demand for high-density power systems rises

Power

5 December 2025

1200V SiC MOSFET power modules in MAACPAK PressFit package

1200V SiC MOSFET power modules in MAACPAK PressFit package

1200V SiC MOSFET power modules in MAACPAK PressFit package

Power

5 December 2025

onsemi launches new cooling packaging technology

onsemi launches new cooling packaging technology

onsemi launches new cooling packaging technology

Power

5 December 2025