The insulated metal baseplate combines an electrically-insulating resin layer with direct-bonded top- and bottom-side copper layers.
It replaces the substrate solder layer and separate baseplate to achieve high thermal cycling capability, reduced thermal resistance, and high power density and low stray inductance.
Direct potting resin distributes the mechanical stress more uniformly than silicone gel for improved power cycling capability.
The first VINco E3 releases are equipped with the latest low-loss Mitsubishi Gen 7 chips.