Products news from Electronic Specifier

Popular Searches

Trending Now

The next mode of transformation: 3D IC integration

ES Blog

16 September 2026

Raytac Bluetooth Low Energy modules in TME's offer

Raytac Bluetooth Low Energy modules in TME's offer

Raytac Bluetooth Low Energy modules in TME’s offer

14 September 2026

Too cool to drift: how thermal engineering is redefining system stability

Too cool to drift: how thermal engineering is redefining system stability

Too cool to drift: how thermal engineering is redefining system stability

24 August 2026

Automotive image sensor to help scale affordable in-cabin sensing

Automotive image sensor to help scale affordable in-cabin sensing

Automotive image sensor to help scale affordable in-cabin sensing

18 September 2026

Keysight EDA software expands access for European chip startups

Keysight EDA software expands access for European chip startups

Keysight EDA software expands access for European chip startups

18 September 2026

JAE DZ17 Series: compact SPE connectors for industrial Ethernet

JAE DZ17 Series: compact SPE connectors for industrial Ethernet

JAE DZ17 Series: compact SPE connectors for industrial Ethernet

18 September 2026

What are You Looking For?

Popular Searches

Trending Now

The next mode of transformation: 3D IC integration

ES Blog

16 September 2026

Raytac Bluetooth Low Energy modules in TME's offer

Raytac Bluetooth Low Energy modules in TME's offer

Raytac Bluetooth Low Energy modules in TME’s offer

14 September 2026

Too cool to drift: how thermal engineering is redefining system stability

Too cool to drift: how thermal engineering is redefining system stability

Too cool to drift: how thermal engineering is redefining system stability

24 August 2026

Automotive image sensor to help scale affordable in-cabin sensing

Automotive image sensor to help scale affordable in-cabin sensing

Automotive image sensor to help scale affordable in-cabin sensing

18 September 2026

Keysight EDA software expands access for European chip startups

Keysight EDA software expands access for European chip startups

Keysight EDA software expands access for European chip startups

18 September 2026

JAE DZ17 Series: compact SPE connectors for industrial Ethernet

JAE DZ17 Series: compact SPE connectors for industrial Ethernet

JAE DZ17 Series: compact SPE connectors for industrial Ethernet

18 September 2026

Home Products Page 46

1200V SiC MOSFET power modules in MAACPAK PressFit package

1200V SiC MOSFET power modules in MAACPAK PressFit package

1200V SiC MOSFET power modules in MAACPAK PressFit package

Power

5 December 2025

onsemi launches new cooling packaging technology

onsemi launches new cooling packaging technology

onsemi launches new cooling packaging technology

Power

5 December 2025

synchronous buck converter

synchronous buck converter

5.5V, 4A, low IQ synchronous buck converter with versatile I2C interface

Power

5 December 2025

Melexis launches free people detection algorithm for its FIR array

Melexis launches free people detection algorithm for its FIR array

Melexis launches free people detection algorithm for its FIR array

Sensors

5 December 2025

byPaige Hookway

ARO Inline Fuse

ARO Inline Fuse

ARO inline fuse – compact, robust, reliable

Power Supplies

5 December 2025

Mini Cool Edge series delivers high-speed data transmission

Mini Cool Edge series delivers high-speed data transmission

Mini Cool Edge series delivers high-speed data transmission

Cables/Connecting

5 December 2025

IMU sensor configures itself

IMU sensor configures itself

IMU sensor configures itself

Sensors

5 December 2025

Storage trends & outlook 2026: navigating the next wave of data growth

Storage trends & outlook 2026: navigating the next wave of data growth

Storage trends & outlook 2026: navigating the next wave of data growth

Memory

5 December 2025

Designing real-world AI hardware at the Edge

Artificial Intelligence

5 December 2025

Certus Semiconductor adopts AI-powered Solido

Certus Semiconductor adopts AI-powered Solido

Certus Semiconductor adopts AI-powered Solido

4 December 2025

Microchip measure power portable devices consumption

Microchip measure power portable devices consumption

Microchip halves power portable devices consume

Power

4 December 2025

Tech leaders expect agentic AI adoption to accelerate in 2026

Tech leaders expect agentic AI adoption to accelerate in 2026

Tech leaders expect agentic AI adoption to accelerate in 2026

4 December 2025

Unlocking chip-scale sensing for new markets

Unlocking chip-scale sensing for new markets

Unlocking chip-scale sensing for new markets

4 December 2025

EMIS, the global electromagnetic compliance specialist, has expanded its range of FeedThrough components designed to improve high-frequency noise suppression and boost system-level EMC performance across industrial, power, communications, defence, and avionics sectors.

EMIS, the global electromagnetic compliance specialist, has expanded its range of FeedThrough components designed to improve high-frequency noise suppression and boost system-level EMC performance across industrial, power, communications, defence, and avionics sectors.

EMIS expands FeedThrough range as industry demand for high-frequency EMC protection rises

Test & Measurement

4 December 2025

Bringing quantum technology to industry

Bringing quantum technology to industry

Bringing quantum technology to industry

4 December 2025

e-peas AEM15820 PMIC enables energy harvesting

e-peas AEM15820 PMIC enables energy harvesting

e-peas AEM15820 PMIC enables energy harvesting from indoor and outdoor light sources

4 December 2025

Filtronic awarded NSIP funding to develop next-generation 550W

Filtronic awarded NSIP funding to develop next-generation 550W

Filtronic awarded NSIP funding to develop next-generation 550W Ka-Band SSPA

Mixed Signal/Analog

4 December 2025

Würth Elektronik presents its film capacitors for noise suppression

Würth Elektronik presents its film capacitors for noise suppression

Würth Elektronik presents its film capacitors for noise suppression

Passives

4 December 2025

onsemi and Innoscience announced the signing of a memorandum of understanding (MoU) to evaluate opportunities to accelerate deployment of GaN power devices

onsemi and Innoscience announced the signing of a memorandum of understanding (MoU) to evaluate opportunities to accelerate deployment of GaN power devices

onsemi and Innoscience announce plans to collaborate to speed global rollout of GaN power portfolio

4 December 2025

Taoglas expands compact chip antenna range for WiFi

Taoglas expands compact chip antenna range for WiFi

Taoglas expands compact chip antenna range for WiFi 6/7

Mixed Signal/Analog

3 December 2025