Memory
Memory controller offers 3D Flash memory support
Fabless semiconductor company, Hyperstone, has introduced its new F9 - CompactFlashT memory controller. The F9 is targeting industrial and high-end CompactFlash cards and embedded IDE disk-on-modules. In conjunction with Hyperstone's hyMap Flash translation layer (FTL) and hyReliabilityT firmware features, the F9 provides enhanced endurance and data retention management, as well as rigorous power fail-safe features.
Enterprise-class SSDs with 64-layer 3D flash memory
Two new enterprise solid state drive (SSD) solutions have been developed by Toshiba Electronics Europe, the TMC PM5 12Gbit/s SAS series and the CM5 NVM Express (NVMe) series. Development is expected to be completed in the fourth quarter. Both product lines are built with TMC’s latest 64 layer, 3-bit-per-cell enterprise-class TLC (triple-level cell) BiCS FLASH, making it possible for today’s demanding storage environments to expand the...
Next-gen client SSD optimised for notebook PCs
Delivering better transfer speeds and power efficiency, Toshiba Electronics Europe has announced the new SG6 series, the latest Toshiba client SSD to feature 64-layer, 3-bit-per-cell TLC (triple-level cell) BiCS FLASH. This family of SSDs is designed for mainstream desktops and notebooks, consumer upgrades, as well as applications needing data security.
Flash controllers feature high capacity SSDs
Provider of semiconductor solutions, Microsemi, has announced the production release of its Flashtec NVM Express (NVMe) 2108 eight-channel controllers, enabling enterprises and data centres worldwide to realise cost and power efficient high capacity Solid State Drives (SSDs).
Single package SSDs reduce size of IoT devices
Based on its latest 64 layer, 3-bit-per-cell TLC (triple-level cell) BiCS FLASH, Toshiba Electronics Europe has announced the availability of the BG3 series, its next-gen single-package ball grid array (BGA) solid state drive (SSD) product line. Designed to fuel the future of mobile devices, Toshiba claims that the BG3 SSDs deliver better performance and a smaller footprint than traditional SATA-based drives.
A new record for magnetic tape storage
Research scientists have achieved a new world record in tape storage – their fifth since 2006. The new record of 201 Gb/in2 in areal density was achieved on a prototype sputtered magnetic tape developed by Sony Storage Media Solutions. The scientists presented the achievement today at the 28th Magnetic Recording Conference (TMRC 2017) here.
Storage solutions for networks in the era of the IIoT
Manufacturer of flash memory solutions, Swissbit, will be exhibiting its latest memory innovations at the Flash Memory Summit 2017 in Santa Clara, California (8-10th August, 2017).
Nanoscale magnetic excitations that can store data
Magnets and magnetic phenomena underpin the vast majority of modern data storage, and the measurement scales for research focused on magnetic behaviors continue to shrink with the rest of digital technology. Skyrmions, for example, are a kind of nanomagnet, composed of a spin-correlated ensemble of electrons acting as a topological magnet on certain microscopic surfaces. The precise properties, like spin orientation, of such nanomagnets can store...
Apacer launches NVMe PCIe SSD
In response to consumer needs for faster big data processing and real-time computing, Apacer Technology has launched the industrial-grade PM110-M280, a high-performance PCIe SSD suitable for cloud computing, IoT, and virtual environments. This enterprise SSD features a PCIe Gen3 x4 interface for faster transmission speeds and supports industry-leading NVMe, greatly improving IOPS and low latency performance and pushing through the bottleneck of p...
World’s first 3D flash memory comes with TSV technology
Toshiba Memory has announced development of the world’s first BiCS FLASH three-dimensional (3D) flash memory utilising Through Silicon Via (TSV) technology with 3-bit-per-cell (triple-level cell, TLC) technology. Shipments of prototypes for development purposes started in June, and product samples are scheduled for release in the second half of 2017. The prototype of this ground-breaking device will be showcased at the 2017 Flash Memory Sum...