Design
The new RE2 embedded computer: High performance, very low power demand and a minimal footprint
The RE2 board from Blue Chip Technology represents a significant advance in embedded computing. It leads the new wave of ARM Cortex A8 embedded computers, due to its OMAP 3 processing core which also integrates a C64x up to 520 MHz DSP. This architecture gives the RE2 the market edge in performance per watt, and a compact design optimised for graphics and computationally intensive tasks. Target applications include high-definition multimedia, ima...
Whitepaper - QDR SRAM and RLDRAM: A Comparative Analysis
Today's high-speed networking applications require high-bandwidth and high-density memory solutions. For instance, typical networking line cards need memories for a variety of operations that include packet buffering, table lookup, and queue management among a host of other functions.
Whitepaper - FleXO(TM): Bridging the Cost/Performance Gap in the Oscillator Market
This paper compares Cypress' FleXO oscillator with the other main types of oscillators. It discusses the advantages, disadvantages, and typical applications of each type.
Whitepaper - TI’s high-performance LTE physical layer solution
With the consumer drive for more and more data, worldwide operators are experiencing an unprecedented need for wireless bandwidth growth. Fortunately, the industry – along with standards bodies such as 3GPP – is evolving support such demand.
Mentor Graphics Introduces Calibre RealTime for Instant Signoff Verification of Custom IC Designs
Mentor Graphics Corporation today announced the new Calibre RealTime platform for signoff-quality physical verification during design creation. The first release provides instantaneous design rule checking (DRC) in the SpringSoft Laker™ custom IC design and layout solution, using the same Calibre decks as the signoff flow.
Nailing Common Misunderstandings About EMI Filters
Despite EMC issues now usually being considered at an early stage during the product design process, unexpected problems still occur. In some cases, a simple approach to EMC and filtering is found to work but, more often than not, a more in-depth analysis is required to address the relevant EMC design considerations and subsequently identify the EMC solution. Misunderstandings are prevalent when selecting EMI filters in the course of equipment de...
Mentor Graphics Helps CamSemi Replace Design and Verification Flow to Improve Simulation Performance and Time to Market
Mentor Graphics Corp. today announced that it assisted CamSemi in replacing their integrated circuit design and verification flow with Mentor tools to improve simulation performance and time to market.
Tekdata adds dynamic 3D modelling to interconnect design capabilities
Tekdata Interconnections has invested in SolidWorks 3D CAD tools to support ongoing expansion of its specialist design services for complex wiring and mechanical assemblies.
GOEPEL electronic extends BSDL Testbench to Multi Chip Modules and 3D Chips
GOEPEL electronic announces the availability of a new option in its recently introduced EDA software TAPChecker. Multi-Chip Modules (MCM) and 3D chips are now supported, allowing testbench generation for VHDL, Verilog and STIL output formats. Users now have the opportunity to verify more complex designs with several Boundary Scan components or dies incl. interconnections by a comprehensive behaviour simulation.
RS Components upgrades DesignSpark PCB with 3D
RS Components has today announced the release of DesignSpark PCB version 2, its free PCB design software package. Working in partnership with Number One Systems, new features in DesignSpark PCB include unique 3D visualisation of PCB layouts, and increased library management functionality. The upgraded version 2 software is free to download for new users at www.designspark.com/pcb, and existing users will be alerted to the upgrade via release al...