Solder paste inspection unit debuts at productronica

12th November 2019

Mick Elliott

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At productronica 2019, Omron has released the new 3D-SPI VP-9000 system used in Printed Circuit Board (PCB) manufacturing process for the production of electric devices. The solution complements its lineup of 3D-AOI and 3D-CT AXI systems, as well as flexible robotics solutions for personalised manufacturing.

Approximately 70% of defects in PCB manufacturing are caused by the printing process of solder paste on the PCB. The new VP9000 solder paste inspection solution from OMRON detects and relays the data to the printer, ensuring reliability.

OMRON’s proprietary multiple inspection switch has 3 resolutions (for example, 15um/7.5um/5um) to enable detailed and high-speed inspection of various PCB characteristics by a single machine.

The 19-inch touch panel and angle adjustment function of the GUI accommodate all perspectives and simple graphic interface allows for intuitive operation.

Thisnew GUI offers very sharp statistical analysis allowing rapid and targeted improvement process. The Statistical Process Control (SPC) station is now widely recognised as one of the most advanced analysis software solutions on the market,able to provide all the necessary data for process control and traceability.

The new VP9000 can complete the loop 3D inspection of a process with the opportunity to correct the excesses of a screen printing process.

Key features of the VP9000 include: