Compared to the SPG-15A, the SPG-20B provides a a 51% improvement in thermal resistance and a 40% improvement in thermal conductivity. When applied between a heat-generating component and a nearby heat sink or spreader, the form-in-place material improves cooling performance by filling all unwanted gaps. Operating across a wide temperature range from -40 to +150°C, the form-in-place material requires no heat curing and does not cause corrosion on metal surfaces and maintain all initial properties. Due to it’s vibration absorption, the SARCON SPG-20B is suitable for both current and emerging higher-frequency electronics applications.
Material delivers thermal conductivity of 2.1W/m°K
The SARCON SPG-15A, a form-in-place thermal interface compound from Fujipoly, has been updated. The easy to dispense SARCON SPG-20B, is a low-viscosity thermally conductive silicone that delivers a thermal conductivity of 2.1W/m°K and a thermal resistance of 1.8°Cm2/W.