SUYIN's Ultra-thin 15-position HD D-sub jack for through-hole reflow pin-in-paste processing
The pin-and-paste process has found widespread use for mounting through-hole technology components using reflow soldering processes originally designed for surface-mount technology. PiP makes it possible to process both of these mounting technologies simultaneously using the same process equipment. The need for an additional wave-soldering process can be eliminated completely, which saves both time and money.By m
The jack contacts, which feature gold-over-nickel plating, are configured for a max. load of 250 V/2.5 A and 5,000 mating cycles; the insulation resistance is specified at 1,000 MΩ and the operating temperature range at –40 °C to +105 °C. Guide pins and snap-in forks help ensure reliable placement and a sturdier hold on the board.
With the aid of the two UNC 4-40 threaded bolts mounted on the sides, the jack can be connected to an HD D-sub plug in a way that resists vibrations and mechanical shock. The housing for these jacks, which are also available in halogen-free versions, are available in the colors blue and black. The jacks can be supplied in tubes or in tape & reel packaging. Depending on the volume of the order/project - beginning at about 100k pieces - SUYIN can make such modifications to nearly any of its existing connector products.
Key specifications at a glance:
Connector type: Ultra-thin HD-D-Sub, Female, right-angle, THR
Number of contacts: 15-pin
Dimensions: 9.8 x 30.9 x 12.5 (L x W x H in mm)
Series number: 070449XR015
6th April 2021
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