New "deep drawn" production technique provides versatile shielding solutions
Laird Technologies has introduced a new solution for emi shielding applications, such as handheld devices, that require significant structural strength, multiple shielding compartments and the highest level of isolation in a cost-effective manner.The
“In addition to this new precision deep-drawn component capability, Laird Technologies now can join this technology with conductive or nonconductive over-moulded products,” said Rick Rothenberger, vice president, Engineering and Technology, Laird Technologies. “This combination results in components that serve multiple functions such as EMI shielding and environmental sealing.”
Deep-drawn components also can be combined with thermal interface materials to create multi-functional heat removal members. Products that use the new Deep Drawing technology also remain RoHS compliant.