Laird Technologies

Address:
Birches Industrial Estate
East Grinstead
West Sussex
RH19 1XH
United Kingdom

Phone: +44 (0) 1342 315044

Fax: +44 (0) 1342 312969

Web: www.lairdtech.com


Laird Technologies articles

Displaying 1 - 20 of 173

A look at 5G mmWave-focused absorber technologies

A look at 5G mmWave-focused absorber technologies
To enable the large increase in wireless data transfer needed for the new 5G wireless standard, spectrum in the millimeter wave range will be needed. There is simply not enough available spectrum in the sub 6GHz range. The millimeter wave range is largely unregulated with wide chunks of available bandwidth making it ideal for data transfer applications. By Paul Dixon, Staff Scientist, Laird Technologies.
8th July 2019

Multi-wireless modem combines low power cellular LTE and Bluetooth

Multi-wireless modem combines low power cellular LTE and Bluetooth
Laird Connectivity has announced a new multi-wireless modem that combines the benefits of low power cellular LTE connectivity and Bluetooth 5 technology into one fully-integrated solution. This combination enables new use cases using low cost, long range Bluetooth sensors all connected to the next generation LTE network in a much simpler and lower cost solution architecture.
5th June 2019

Automated solutions for all forms of thermal interface materials

Automated solutions for all forms of thermal interface materials
  Automation solutions for all forms of Thermal Interface Materials (TIMS) are offered by Laird Performance Materials (LPM). The company offers dispensable gap fillers, printed thin gap TIMs (TIM Print), ‘robotic motion control’ placed thick –gap TIMs (TIM Pick). 
9th May 2019


Automated solution to apply traditionally difficult materials

Automated solution to apply traditionally difficult materials
TIM Print is a novel method to apply Laird Performance Materials’ thermal management die cut pads while reducing total cost of ownership. It offers a more robust, reproducible and reliable application process as compared to traditional ‘peel and stick’ and dispensing methods.
9th May 2019

Cost effective automated thermal pad application for die cut TIMs

Cost effective automated thermal pad application for die cut TIMs
A new method has been introduced to apply Laird Performance Materials’ thermal management die cut pads while reducing total cost of ownership, with the TIM Pick. It offers a more robust, reproducible and reliable application process as compared to traditional ‘peel and stick’. TIM Pick uses robotic motion control with an innovative ‘pick head’. 
9th May 2019

Thermoelectric modules protect heat sensitive CMOS sensors

Thermoelectric modules protect heat sensitive CMOS sensors
It has been announced that Laird Thermal Systems has expanded its Peltier thermoelectric module product family with the HiTemp ET Series, designed to protect critical electronic devices like CMOS sensors in high temperature applications. Recent advances in CMOS sensor technology have made these sensors practical and effective for use in a wide range of imaging applications.
1st May 2019

BLE sensor features external probe for food safety

BLE sensor features external probe for food safety
Laird Connectivity has developed a new sensor that features integrated antennas, an external temperature probe and rugged IP65 enclosure. The Sentrius RS1xx External Series probe allows customers to mount the sensor outside of a device and measure the temperature inside via the cabled sensor. Designed for a wide range of cold chain management applications like agriculture and food safety monitoring, the RS1xx External Series probe makes it easy to monitor environmental data.
22nd March 2019

Thermoelectric assembly increases cooling performance by up to 60%

Thermoelectric assembly increases cooling performance by up to 60%
Laird has launched a high performance thermoelectric assembly (TEA) series for indoor lab environments that offers a higher cooling performance per unit volume. The SuperCool Series TEA features a hot side air heat sink design that dissipates heat more efficiently than competing heat exchanger technologies. Utilising optimised thermoelectric modules (TEMs) in combination with a high performance heat sink and fan shroud assembly, the SuperCool TEAs transfers heat to air more rapidly.
2nd August 2018

Thermoelectric modules designed for high temperature environments

Thermoelectric modules designed for high temperature environments
Laird has expanded its thermoelectric module (TEM) product family to protect critical electronic devices in emerging applications found in high temperature environments. This typically occurs in outdoor environments where heat generated from surrounding electronics exceeds the temperature of sensitive electronics with maximum operating temperatures of 60~70ºC.
13th June 2018

The latest models of the thermoelectric assembly product line

The latest models of the thermoelectric assembly product line
  Laird has expanded its thermoelectric assembly (TEA) product offering to include a higher capacity range for critical medical equipment. Previously, the Tunnel Series TEAs offered cooling for capacities up to 39 W. The boosted Tunnel Series now offers cooling capacities exceeding 100 W to support a wider range of cooling applications.
8th November 2017

Sensor platform simplifies integration into IoT networks

Sensor platform simplifies integration into IoT networks
  Laird is going to be launching a new multi-wireless sensor platform that enables enterprise customers to deploy secure, stable wireless sensors in long-range Enterprise Internet of Things (EIoT) applications, especially those requiring precise temperature and humidity control.
11th July 2017

Transceiver coolers suitable for optical communications market

Transceiver coolers suitable for optical communications market
Laird has developed a platform of customisable thermoelectric assemblies (TEAs) specifically designed for thermal management in small form-factor pluggable (SFP) transceivers. Optical transceivers are used in communication equipment to transmit data at distances up to 1 km away for outdoor applications. Each unit contains a temperature sensitive laser diode, and the ability to transmit data at higher speeds depends on keeping the temperature typically below 70ºC.
22nd May 2017

Compact chillers deliver precise temperature control

Compact chillers deliver precise temperature control
Laird has designed a benchtop re-circulating chiller for laser applications that require precise and continuous temperature control. The self-contained MRC Series thermoelectric re-circulating chiller offers dependable, compact performance by controlling the temperature of a coolant in a liquid circuit. In applications with a cooling capacity requirement below 400 Watts, the compact MRC Series offers a considerable size and weight advantage over conventional compressor-based systems.
24th March 2017

How to connect the RM1xx LoRa module to a multitech gateway

This video walks through how to connect an RM1xx LoRa module to a multitech gateway.
10th January 2017

Thermoelectric assemblies deliver precise thermal management

Thermoelectric assemblies deliver precise thermal management
A smaller, more efficient option for precise thermal management in compact CO2 incubators using thermoelectric assemblies (TEAs) has been developed by Laird. When employed with the advanced SR-54 temperature controller, thermoelectric assemblies use less energy to maintain the desired temperature range, lowering the cost of ownership when compared to standard compressor-based systems.
7th October 2016

LoRaWAN and Bluetooth v4.0 - opening the box

The RM1xx series of modules offer a powerful, convenient solution for long-range EIoT (Enterprise IoT) deployments. This video walks you through what to expect when you get your RM1xx Development Kit and shows you where to find everything you need to get started.
6th October 2016

Thermal management for semiconductor process equipment

Thermal management for semiconductor process equipment
The critical production tools used in semiconductor fabrication facilities must be reliable and easy to service in order to minimise downtime. Laird has developed custom cooling and temperature control systems, including heat exchangers, pumps, sensors, thermoelectric modules, thermoelectric assemblies, thermoelectric chillers, compressors, flow controllers and temperature controllers, to keep semiconductor fabrication equipment running at precise temperatures.
24th August 2016

Thermoelectric assemblies optimise liquid chromatography equipment

Thermoelectric assemblies optimise liquid chromatography equipment
Laird has simplified the product selection and thermal design process by offering standard and custom thermal management solutions that offer precise temperature control to optimise the performance of liquid chromatography equipment. Depending on the heat load capacity requirements of the High Performance Liquid Chromatography (HPLC) equipment, these thermal systems are comprised of Laird's advanced SR-54 series temperature controller in combination with either the Tunnel series or PowerCool series Thermoelectric Assemblies (TEAs).
12th August 2016

Thermoelectric modules enhance reliability of PCR cyclers

Thermoelectric modules enhance reliability of PCR cyclers
Laird has developed an advanced ThermoElectric Module (TEM) designed for high reliability applications like Polymerase Chain Reaction (PCR) thermal cycling, which require extended Mean Time Between Failure (MTBF). The Polymerase Chain Reaction (PCR) is a biochemical technology that amplifies a single copy or a few strands of DNA across several orders of magnitude, generating several hundred thousands of copies of a particular DNA sequence.
1st March 2016

Thermoelectric temperature controllers shorten development time

Laird has launched a series of easy-to-use temperature controllers specifically designed for closed loop feedback control of Thermoelectric Assemblies (TEAs). The PR-59 series proportional controller is configurable and can be integrated into a system with a minimal amount of programming, allowing design engineers to shorten product development and move products to market faster.
29th February 2016


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