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Low Profile Heat Sinks Cool Hot Components In Constricted Packages

13th January 2010

Advanced Thermal Solutions (ATS Europe BV)

ES Admin

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Advanced Thermal Solutions introduced a line of lower height maxiFLOW heat sinks for cooling ICs and other hot components in narrow packaging and low airflow velocity conditions. The maxiFLOW heat sinks feature a spread fin array that maximizes surface area for more effective convection (air) cooling. Standard sink heights are as low as 9.5 mm.

The heat sinks are fabricated from extruded aluminum which minimizes thermal resistance from the base to the fins and minimizes weight. Tests on maxiFLOW heat sinks using an airflow rate of just 100 lfm (linear feet per minute) show that device junction temperatures (Tj) can be reduced by more than 40 percent below the temperatures achieved using other heat sinks.

Low profile maxiFLOW heat sinks are provided pre-assembled with ATS maxiGRIP™ mounting hardware. This attachment system includes a plastic frame clip that snaps securely around the component. A stainless steel spring clip runs through the fin field and fastens to the frame. The result is steady, even mounting pressure with no holes in the PCB. These assemblies meet Telcordia GR-63-Core; ETSI 300 019; and MIL-STD-810 shock and vibration testing standards. A thermally conductive, phase-change interface pad maximizes the heat transfer from component to the cooling solution.