Qorvo is at the forefront of emerging RF applications for IoT, smart homes, 5G, Wi-Fi, Ultra-Wideband (UWB), and sensor and power products. These markets and applications require next-generation devices to support the rising number of frequency bands with highly integrated functions. This creates challenges for consumer electronics, communication equipment and smart appliance manufacturers, which must accommodate this complexity on smaller and smaller form factors.
Adeia’s hybrid bonding technologies help companies like Qorvo optimise 3D structures, packages, and interconnect innovations. Hybrid bonding technology elevates performance and expands functionality on miniaturised footprints. It will play a critical role in the design and development of emerging devices and connected services.
“Semiconductor industry leaders are looking to 3D structures, packages, and interconnect innovations to elevate performance and expand functionality on miniaturised footprints,” said Dana Escobar, Chief Licensing Officer and General Manager, Semiconductors, for Adeia. “Hybrid bonding technology introduces new opportunities to optimise the architecture of the RF front-end semiconductor devices and modules to enhance functionality, performance and size of the solutions.”
Adeia has made fundamental advances in the semiconductor industry over the last 30 years. With a large and growing portfolio of intellectual property covering hybrid bonding, semiconductor packaging and semiconductor processing technologies, Adeia licenses and partners with leading semiconductor companies around the world to enhance product roadmaps.