Products
TE Connectivity Develops LGA 1944 Socket For AMD’s New High-Performance Opteron 6000 Series Server Processor
TE Connectivity (TE) announces a new surface-mount LGA socket for AMD's new high-performance Opteron 6000 series server processor. The LGA 1944 socket is validated to the processor’s high speed/ high performance specification. TE is one of the few suppliers able to provide this kind of technology and products.
IDT Introduces Thermal Sensor for DDR3 Memory Modules to Expand Cloud Computing Portfolio
Integrated Device Technology today introduced a new family of low-power, precision temperature sensors targeted at Double Data Rate 2 and 3 (DDR2 and DDR3) memory modules, Solid State Drives (SSD), and computing motherboards. These new devices complement IDT’s PCI Express®, signal integrity, flash memory controller, power management, and timing products to offer a rich set of application optimized enterprise computing solutions.
XP Power accepted as a Full Member of the Electronic Industry Citizenship Coalition (EICC)
XP Power announced that it has been accepted as a Full Member of the Electronic Industry Citizenship Coalition (EICC). The EICC is a collaboration of leading electronics companies that promotes an industry code of conduct for global supply chains to improve working and environmental conditions.
ATC Semitec - Interchangeable (RT Curve-Matched) NTC Thermistors
ATC Semitec’s SP interchangeable series is a range of NTC thermistors that offers very high precision (±0.2°C 0~70C or better) at significantly lower pricing to that of existing interchangeable NTCs.
G3-PLC Chipset Complies with IEEE P1901.2 Prestandard for Smart Grid Communications
Maxim introduces the MAX2992, an OFDM-based powerline communication (PLC) modem that pairs with the MAX2991 analog front-end (AFE) to provide a complete PLC chipset for smart grid communications. This chipset complies with the emerging IEEE P1901.2 standard for OFDM-based communication over power lines and offers guaranteed interoperability. This standards compliance is critical to enabling smart grid deployments, as it helps utilities safeguard...
FDB launch Pocket Lock
The innovative Pocket Lock recently launched by FDB Panel Fittings has its primary use in areas where shared desking or lockers is required. The lock and key fit together to form a small pocket size “pod” which can be retained by the user and simply inserted into any vacant lock the following day. This maintains total flexibility whilst ensuring each user still has a secure storage or workspace during the day.
Allegro MicroSystems - Fully integrated DMOS motor driver IC
The new A4950 from Allegro MicroSystems Europe is a fully integrated single full-bridge DMOS motor driver IC designed to drive DC brush motors with continuous output currents of up to 2.5 A.
Ultra-miniature MOSFETs from Diodes Incorporated deliver cooler running than larger packaged devices
Diodes Incorporated has unveiled a portfolio of high performance MOSFETs packaged in the ultra-miniature DFN1006-3 package. Occupying just 0.6mm2 of PCB area, the package takes less than half the board space of equivalent SOT723 packaged parts and with a junction to ambient thermal resistance (Rthj-a) of 256 ºC/W, supports a power dissipation of up to 1.3W under continuous conditions, double that of comparable alternatives.
Teknek Introduces High Performance Solution For Cleaning Thin Film
The problem of cleaning thin films has been solved by Teknek, the global leader in contact cleaning technology, with the introduction of the Ultracleen range of cleaning roller.
QSC Streamlines Production Test with ScanExpress JET
QSC Audio Products, LLC has been a leader and pioneer in professional audio products and systems for over four decades. At their 81,000 square foot, state-of-the-art production facility in Costa Mesa, California, the engineers at QSC develop and manufacture high reliability professional audio equipment—products proudly featured in sports stadiums, performance theaters, cinemas, and even cruise ships.