Buck-boost converter shielding enhances thermal performance

Posted By : Mick Elliott
Buck-boost converter shielding enhances thermal performance

Packaged as a 25-pad LGA with 6-sided shielding, the RECOM RBB10 buck-boost converter, now available from Dengrove Electronic Components, is ideal for equipment such as USB voltage regenerators, 3.3V-to-5V converters, and supercapacitor or Li-Ion battery regulators.

The all-round shielding enhances thermal performance as well as preventing electromagnetic interference.

This non-isolated power module can supply up to 4A at 5V nominal output voltage, from an input that can range from 2.3V to 5.5V. Achieving up to 96% efficiency, it will operate at full load in 85°C ambient temperature without forced-air cooling.

Measuring 12.19mm x 12.19mm, the RBB10-2.0 footprint is compatible with the industry-standard DOSA third-generation, high-density, non-isolated PICO converter specification.

On the other hand, at just 3.75mm high, it delivers a space-saving solution where an ultra-low profile is needed.

External pins provide rich control and monitoring options, including Trim and Sense pins that allow the output voltage to be trimmed over a range between 1.0V and 5.5V by using external resistors.

In addition, a Mode pin selects powersave operation as a default, entering burst mode at loads under 350mA to reduce power consumption and extend battery life.

Setting the Mode pin low for permanent PWM operation prioritises accurate output-voltage regulation independently of the load current.

There is also a Control pin for activating the device or selecting the 7µA standby mode, and a Power-good indicator for status monitoring.

An evaluation board, RBB10-2.0-EVM-1, is available to help customers test the modules. Resistors are provided on-board for trimming the output voltage, as well as break out connectors for selecting operating modes.

The board also features optimal thermal management and a class-B EMI filter layout.

Downloads


You must be logged in to comment

Write a comment

No comments




Sign up to view our publications

Sign up

Sign up to view our downloads

Sign up

embedded world 2019
26th February 2019
Germany Nuremberg
Wearable Tech Show 2019
12th March 2019
United Kingdom London
AMPER 2019
19th March 2019
Czech Republic Brno Exhibition Centre
LOPEC 2019
19th March 2019
Germany Messe Munchen
RF & Microwave 2019
20th March 2019
France Paris Expo, Porte de Versailles