News & Analysis

MacDermid Alpha presents next gen Assembly & Interconect tech at TechBlick

3rd October 2022
Sheryl Miles

MacDermid Alpha Electronics Solutions, a global supplier of integrated solutions from Circuitry, Assembly and Semiconductor divisions, will present the technical paper: ‘Next Generation Assembly and Interconnect Technologies for Smart Structures and Functional Surfaces’ at the TechBlick Conference and Expo taking place 12 – 13 October 2022 in Eindhoven, Netherlands.

Rahul Raut, Global Portfolio Manager, FFPE at MacDermid Alpha, will discuss the key building blocks of 3D smart structural platforms, covering novel film substrates which include multifunctional PC substrates for In-Mould Electronics, highly conductive and formable Silver Inks, high performance formable Dielectrics, formable structural and electrically conducting adhesives (ECAs) and formable encapsulants. The performance and capability of integrated multi-layer stacks that can be thermoformed and then injection moulded to produce smart, interactive 3D structures will be presented, as well as the ability of these integrated 3D structures to meet or exceed the stringent reliability requirements for automotive, medical, white goods and other demanding applications.

MacDermid Alpha’s suite of electronic inks, coatings and film materials are designed to meet the functional and reliability requirements for In-Mould Electronics, Functional HMI (Human-Machine Interface) Surfaces and Adhesively Laminated FPCs.

They offer a comprehensive suite of fully compatible materials, processing and applications support for films, electronic inks & adhesives to produce 3D Smart, Functional and 3D Automotive HMI Structures.

Our film capabilities include functional and decorative solutions, such as heat-stabilised Autostat PET and XtraForm PC films. Additionally, our electronic materials portfolio provides integrated electronics capabilities for the printed circuit board and semiconductor industries. We provide an inter-compatible comprehensive solution of electronic materials, films, and processes.

Rahul Raut will present the technical paper on 12th October during the TechBlick Conference. MacDermid Alpha will also participate in the TechBlick expo, visit their table to discuss the latest technologies for 3D In-Mould Electronics.

To register for TechBlick please visit: https://www.techblick.com

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