Alphawave Semi brings next-gen innovations to ECOC 2025

Alphawave Semi brings next-gen innovations to ECOC 2025 Alphawave Semi brings next-gen innovations to ECOC 2025

Alphawave Semi, a global player in high-speed connectivity and compute silicon for the world’s technology infrastructure, will showcase the latest advances in AI and connectivity IP at the European Conference on Optical Communication (ECOC) 2025.

Taking place this year at the Bella Center in Copenhagen, Denmark, ECOC is one of Europe’s leading optical communications conferences, bringing together experts from academia, research, and industry.

Building on the company’s previously announced DSP launch at OFC, Alphawave Semi continues to expand its leadership in high-performance connectivity. Its comprehensive portfolio enables high-speed communications across both electrical and optical channels, extending distances of up to 20km. This innovation is underpinned by Alphawave Semi’s PAM4 SerDes, the differentiated WidEye DSP technology and EyeQ advanced diagnostics technology – all designed to address the scale and performance demands of hyperscalers deploying accelerated AI compute infrastructure.

At the event, Alphawave Semi will also showcase a broad range of solutions, including:

  • Cu-Wave PAM4 DSP for Active Electrical Cables (AEC)
  • O-Wave PAM4 DSP for Optical Retimer and Gearbox Transceivers
  • Co-Wave Coherent-lite DSP for Optical Transceivers

Together, these solutions highlight Alphawave Semi’s commitment to delivering silicon-proven, production-ready technologies that enable the next generation of AI, cloud, and high-performance computing platforms.

Attendees will also have the opportunity to meet with the Alphawave Semi team to learn more about the company’s latest innovations, including:

  • 224G PAM4 Electrical SerDes: 224G XLR IP subsystem solutions unlocking the next generation of high-speed connectivity
  • 6T I/O Chiplets: silicon-ready chiplet technologies for PCIe and Ethernet, featured in the multi-vendor interoperability demonstration at 112G
  • 36G UCIe Die-to-Die (D2D) IP Subsystem: demonstrating breakthrough 36Gbps UCIe IP Subsystem on TSMC 3nm. Live D2D traffic at 36 Gbps unidirectional per lane. Enabled for 64 Gbps and supporting emerging D2D use-cases, including optical I/O chiplets
  • Optical PCIe Subsystem: demonstrating interoperability over optics with a Test & Measurement Golden Reference Link Partner
  • Multi-vendor ecosystem collaborations: demonstrations on 224G, Optical-Aware PCIe, and Ethernet chiplets, showcasing robust technology deployments for AI architectures at OIF and Ethernet Alliance interoperability booths

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