Teknek to Showcase Advanced Contact Cleaning Technology - Nanocleen - At Productronica 2009

Nanocleen, which was five years in development, offers unrivalled contamination elimination and static control benefits in the electronics production environment. Teknek pioneered the development of contact cleaning equipment 25 years ago and has remained at the forefront of innovation in the sector ever since. It now has an installed user base of 16,000 “clean machines” world-wide and it is estimated that customers using its yield improvement technology have saved in excess of $2bn.

At the core of the Nanocleen system is a specially formulated roller and adhesive roll. Nanocleen offers a number of advantages over conventional contact cleaning systems including:

· The unique polymer roller can remove much smaller particles – down to 25nm in size. This is important as electronic circuits become ever finer and components smaller making the impact of contamination that much greater.

· Nanocleen’s high performance roller can remove 25-50% more particles than other contact cleaners.

· The roller dissipates static as well as removing contamination. Static is reduced by a factor of 10 compared to traditional contact cleaners. Sensitive electronic components are susceptible to static and can be damaged if static is present in the production process.

· The roller and adhesive roll are 100% silicone free. Traditional rollers and adhesive rolls contain silicones which can potentially contaminate the production line.

The Nanocleen system can be fitted to old and new versions of the Teknek Clean Machine as well as other makes of contact cleaning machine using an optional upgrade kit so investment in new hardware is unnecessary.

Stephen Mitchell, managing director, Teknek said: “Substantial research and development resources have gone into the development of Nanocleen as well as extensive testing with existing customers.”

He added: “Nanocleen sets new standards in contact cleaning technology for the electronics sector. There is no more effective method for removing contamination and reducing static. It offers users a clear competitive advantage in terms of yield improvement and waste reduction.”