The collaboration builds on more than a decade of success between the two companies, with Spreadtrum shipping more than 2 billion feature phone and smartphone chips to-date powered by CEVA DSPs.
“We are pleased to announce our continued close relationship with CEVA as we embark on the next phase of our smartphone platform expansion to include the mid-range and premium smartphone markets,” said Dr. Leo Li, Chairman and CEO, Spreadtrum. “CEVA’s DSPs are an important building block in these SoCs, bringing outstanding power-efficiency and highly-optimised performance to the wide range of applications they perform.”
“Spreadtrum are set to be a leading disruptor in the LTE smartphone market, bringing highly-advanced smartphone SoCs to the global market and we are proud to expand the adoption of our DSPs to LTE advanced, voice, audio and sensor processing,” said Gideon Wertheizer, CEO, CEVA. “With more than 6 billion wireless subscribers globally still using 2G and 3G networks today, the mass-market opportunity for LTE remains largely untapped and Spreadtrum is ideally positioned to address every smartphone market segment with their CEVA-powered chipsets.”