News & Analysis
congatec Unveils New COM Express Basic Module with ECC Support
congatec AG, a leading manufacturer of embedded computer modules, adds the conga-BE57 to its COM Express product family. Designed for DDR3 ECC SODIMM memory modules and equipped with extremely low power Intel® processors in a BGA package, the conga-BE57 is particularly suitable for mission critical applications.
NXP Showcases Smart, Energy-Efficient Chips
At electronica 2010 this week, NXP Semiconductors N.V. (Nasdaq: NXPI) will highlight how semiconductors are enabling a new level of energy efficiency across key application areas including lighting, automotive, solar power and power supplies, as well as smart appliances, buildings and homes. NXP is showcasing a selection of its smarter chip solutions offering excellent ROI in terms of energy savings (Hall A4, Stand 542).
NXP to Drive Automotive LEDs With Automotive-Qualified Technology
NXP Semiconductors N.V. (Nasdaq: NXPI) today announced the availability of fully integrated, highly flexible driver IC solutions designed for vehicle LED headlights and tail lights, based on automotive-qualified technology. The ASL1010NTK and ASL1010PHN are the industry’s first automotive LED driver ICs to integrate critical functionality such as direct LED temperature feedback, LED fault detection, internal PWM control for dimming, and short c...
Volex Wins Most Supportive Company Award From Philips
Volex Group plc has been awarded the Most Supportive Company Award by Philips, a world leader in healthcare, lifestyle and lighting, at an event held by the Consumer Lifestyle Garment Care Division in Singapore.
Shortlink adds ultra low power RF transceiver to ASIC building block portfolio
Shortlink announced today the introduction of an ultra low power RF transceiver to its growing ASIC building block portfolio. Consuming just 8mA, the transceiver is the first variant in a family of customisable transceivers and uses less than 50% of the power of typical discrete RF modules or transceiver ICs.
Shortlink and LFoundry in RF and mixed-signal IP partnership
Shortlink AB and Landshut Silicon Foundry GmbH today announced a partnership agreement to provide Shortlink low power RF and mixed-signal custom IP in LFoundry's industry leading LF150 modular 150nm CMOS process technology.
Atmel Expands ARM Cortex-M3 Flash MCU Family with SAM3N Series
Today at Electronica 2010, Atmel® Corporation (Nasdaq: ATML), a leader in microcontroller and touch solutions, announced the new Atmel SAM3N series to expand their ARM® Cortex(TM)-M3 Flash Family. The new SAM3N series offers high performance, low-power consumption and scalable memory, pin-count, package options and capacitive touch support.
Atmel Introduces First 32-bit AVR Microcontroller Featuring Floating Point Unit
Today at Electronica 2010, Atmel® Corporation (Nasdaq: ATML), a leader in microcontroller and touch solutions, announced the first 32-bit AVR® microcontrollers (MCUs) with a floating point unit (FPU). Targeting industrial control applications, the new Atmel AVR UC3 C MCU series offers a unique mix of high-processing power, true 5V operation, high-speed communication and advanced safety and reliability features packaged in a range of small...
PerkinElmer Launches New DigiPile Family of Digital Thermopiles for Thermometry, Pyrometry and Non-Contact Temperature Sensing Applications
PerkinElmer, Inc., a global leader focused on improving the health and safety of people and the environment, today announced the debut of its new DigiPile(TM) Family of Digital Thermopiles.
Intersil's Breakthrough ISL8200MM Power Module Now Ready for Defense Applications
Intersil Corporation (NASDAQ Global Select: ISIL) today introduced a version of its popular breakthrough ISL8200M DC/DC power module designed for defense, harsh environment and avionics applications.