News & Analysis
Experience NXP in Automotive
NXP Semiconductors, Leader in High Performance Mixed Signal solutions, experience NXP's Automotive capabilities
DLP-HS-FPGA High-Speed FPGA Module
DLP Design, Inc. announced the new DLP-HS-FPGA high-speed FPGA module based on silicon from Xilinx and FTDI.
DeLorme Earthmate PN-60w with SPOT Satellite Communicator Among Innovation Leaders at CES
The Earthmate PN-60w with SPOT Satellite Communicator comprises the world's first handheld GPS capable of sending custom text messages using SPOT satellite technology. Ideal for anyone from outdoors enthusiasts to international relief workers, it introduces a revolutionary new way to communicate from remote locations beyond the reach of cell phone coverage.
OMAP™ 5 platform: Transforming mobile devices
This video showcases some of the enhanced consumer experiences enabled by TI's OMAP™ 5 platform technology.
Oxford Advanced Surfaces to exhibit core technology at Nanotech 2011, Japan
Oxford Advanced Surfaces Group Plc (OAS), the advanced materials company, announced today that they will be exhibiting at the Nanotech 2011 Exhibition in Tokyo from Feb 16th through 18th. Nanotech International Nanotechnology Exhibition & Conference is the world’s largest nanotechnology fair and an essential event for state-of the-art manufacturing.
Oxford Advanced Surfaces validates core adhesion technology for Printed Electronics
Oxford Advanced Surfaces Group Plc (OAS) has announced today that it has successfully completed the Technology Strategy Board -funded project work on Customised Adhesion of Inter-layers for Plastic Electronics (CAIPE). The project aimed to develop a much needed solution to the persistent interlayer delamination problems facing device manufacturers in Plastic Electronics. In collaboration with their project partners PETEC (Printable Electronics Te...
Fluke Networks Teams with Ingram Micro to Foster Greater Partner Growth in the U.S.
Fluke Networks, the leader in network installation, monitoring and analysis, today announced that, effective Feb. 7, Ingram Micro Inc., will serve as its preferred master distribution partner in the U.S. for products including Fluke Networks’ EtherScope™ Network Assistant, DTX CableAnalyzer™, OptiView® Network Analyzer, as well as for products from AirMagnet™ and Visual Network Systems. Under the expanded distribution ...
NanoKTN Confirms Chairman of NICE as Keynote Speaker at Nano4Life 2011
The Nanotechnology Knowledge Transfer Network (NanoKTN), one of the UK’s primary knowledge-based networks for Micro and Nanotechnologies, is pleased to confirm Professor Sir Michael Rawlins, Chairman of NICE, as keynote speaker at Nano4Life 2011. The one-day conference and exhibition, now in its third year, will explore the key areas within the life sciences where nanotechnology looks to advance healthcare provision, improve product discovery a...
Toumaz CEO Professor Chris Toumazou to present “Electronics for healthy living” at International Solid State Circuits Conference (ISSCC) 2011
Toumaz, the leading provider of ultra-low power wireless telemetry technologies for medical monitoring and internet-connected consumer devices, today announces that Toumaz CEO Professor Chris Toumazou FRS will be an invited speaker at the 58th International Solid State Circuits Conference (ISSCC), the premier forum for presenting advances in solid-state circuits and systems-on-a-chip (February 20th–24th 2011, San Francisco, California). The the...
Tensilica Showcases 4G LTE Baseband DSP IP Cores at MWC 2011
Tensilica should stand out at this year's Mobile World Congress (MWC) in Barcelona, February 14-18, 2011, as it has moved into the number one position as the supplier of baseband DSP (digital signal processors) IP (intellectual property) cores for the new generation of 4G LTE (Long Term Evolution) equipment. Eight of the top 15 LTE chipset manufacturers are working with Tensilica's cores for their designs.