News & Analysis
Imec reports reconfigurable radio solutions enabling low-cost and low-power spectrum sensing
Imec presents a digital front-end component for low-cost and low-power spectrum sensing, paving the way to power-efficient cognitive radios and networks. The new results support industry’s search for increased flexibility and reliability for their next-generation wireless devices.
Broadcom's New Combo Chip Integrates 802.11n Wi-Fi, Bluetooth 4.0 + HS and FM to Bring New Multimedia Applications to Smartphones, Tablets and Other Mobile Devices
Broadcom announced its newest wireless combination (combo) chip designed to support more media and data applications without impacting size or battery life for smartphones, tablets and other mobile devices. The BCM4330 integrates Broadcom's industry leading 802.11n Wi-Fi, Bluetooth and FM radio technologies on a single silicon die providing significant cost, size, power and performance advantages over discrete semiconductor implementations, makin...
Gary Meyers Named to Oasys Design Systems’ Board of Directors
Gary Meyers, an experienced electronic design automation (EDA) and semiconductor executive, has been named to the Board of Directors of Oasys Design Systems, provider of Chip Synthesis™, a fundamental shift in how synthesis is applied to integrated circuit (IC) design and implementation.
Atmel Digital Temperature Sensors
The Atmel expanding portfolio of digital temperature sensors can be used to address a variety of temperature monitoring needs in applications such as DDR3 DIMMs, Lithium Ion (Li-Ion) and Lithium Polymer batteries, Plasma and LCD TVs, notebook and desktop computers, workstations and servers, digital video recorders (DVRs), energy meters, industrial controls, and various medical devices.
Integrating AT-MINI bootloader in mikroElektronika AVR compilers
This is a short demonstration of how to integrate AT-mini bootloader in mikroElektronika AVR compilers.
AirWalk, Mindspeed and Lime Microsystems Collaborate on LTE Small Cell Technology Development
AirWalk Communications Inc., the leader in innovative small cell radio access networks, Mindspeed Technologies, Inc.(NASDAQ: MSPD), a leading supplier of semiconductor solutions for network infrastructure applications; and Lime Microsystems, a semiconductor company specializing in digitally configurable transceivers for the next generation of wireless broadband systems, have together developed an LTE small cell product to be on display in Barcelo...
NEXCOM Increases Production Capacity by 50% with the Opening of a New Manufacturing Site in Banqiao, Taiwan
NEXCOM – world leaders in the manufacture of Mobile and Industrial Computer Solutions; has announced that it has moved its manufacturing facility from Zhonghe to a much larger site in Banqiao, Taiwan. The new production facility comes with a 50% increase in floor space to 10,000 square meters. Furthermore, the new factory includes a SMT line, DIP line and a system line, increasing NEXCOM's production capacity by 50%. This increase in capacity w...
Agilent Technologies Completes Acquisition of A2 Technologies' Assets
Agilent Technologies has completed the acquisition of specific assets of A2 Technologies. Financial details were not disclosed for the acquisition, which was first announced Jan. 19. The acquisition supports Agilent's goal of expanding its spectroscopy business. Substantially all of A2 Technologies' intellectual property, technology and spectroscopy product portfolio are now part of Agilent's Spectroscopy Solutions Division within its Chemical An...
Agilent Technologies to Demonstrate Industry-First Design and Test Solutions for 3G/4G and LTE-Advanced at Mobile World Congress
Agilent will demonstrate its leading-edge communications test and measurement solutions for 3GPP LTE-Advanced, LTE,W-CDMA, HSPA+, E-EDGE (EDGE Evolution), UMA/GAN, WiMAX(tm), and femtocells at the Mobile World Congress in Barcelona, Feb. 14-17.
STMicroelectronics and bTendo to Develop Focus-Free Embedded Pico-Projector for Next-Generation Smart Phones
STMicroelectronics and bTendo Ltd. announced today that they have signed a development and license agreement to jointly develop the world’s smallest Pico Projector for smart phones and other portable consumer-electronics devices. The solution is based on bTendo’s innovative Scanning Laser Projection engine technology and ST’s leading MEMS (Micro-Electro Mechanical Systems) expertise, video processing know-how and semiconductor process tech...