Memory

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Ramtron’s F-RAM wins EDN China’s Industry Innovation award

Ramtron’s F-RAM wins EDN China’s Industry Innovation award
Ramtron International Corporation has announced that it has received the Leading Product accolade in this year’s prestigious EDN China Innovation Awards. Ramtron’s FM22L16, the semiconductor industry’s first 4-megabit (Mb) nonvolatile F-RAM memory, was selected by a panel of judges and thousands of EDN China readers as a Leading Product in the Digital IC and Digital Logic category.
3rd December 2007

Innovative Silicon Wins Prestigious Audemars Piguet “Changing Times Award”

Innovative Silicon Inc. (ISi), the developer of Z-RAM high-density memory intellectual property (IP), has announced that it has won the Audemars Piguet 2007 “Next Gem” award, one of three awards within the Audemars Piguet “Changing Times Award” program. The “Next Gem” award is given to the private company with the most promising future of making the biggest impact, on the largest number of people, in the least amount of time.
3rd December 2007

Embedded-FRAM device for digital TV enables simultaneous use of 4-channel HDMI connector ports

Embedded-FRAM device for digital TV enables simultaneous use of 4-channel HDMI connector ports
Fujitsu Microelectronics Europe has announced the development of what it says is the world’s first embedded-FRAM device for digital TVs that enables simultaneous use of four-channel High-Definition Multimedia Interface connector ports - for connecting devices such as multiple DVD recorders, camcorders, and video game consoles – and which stores display data, such as resolution, that is read by audio-visual digital entertainment devices when they are used with digital TVs.
29th November 2007


FRAM memory device qualified to +125ºC for intelligent powertrain applications

FRAM memory device qualified to +125ºC for intelligent powertrain applications
Ramtron International has expanded its line of +125 degreesC FRAM memory automotive devices. The FM25L04-GA , a 4Kb, 3 volt, serial peripheral interface (SPI) FRAM, is now Grade 1 AEC-Q100-specified to operate over the automotive temperature range of -40ºC to +125ºC and is guaranteed to retain data for 9,000 hours at that extreme temperature.
31st October 2007

FRAM memory designed into fimicro's PC/104-compliant single board computer and smart I/O modules

Ramtron International has announced that German-based embedded hardware and software provider, fimicro, has integrated non-volatile FRAM memory into its new active104 series of PC/104-compliant single board computer (SBC) and smart I/O extension modules.
17th October 2007

Ramtron expands high density FRAM family with a 2-megabit device

Ramtron expands high density FRAM family with a 2-megabit device
Ramtron International has extended its family of high density FRAM devices with a 2-megabit parallel memory device. The FM21L16 is a 2Mb, 3-volt, parallel non-volatile FRAM in a 44-pin TSOP-II package that features fast access, NoDelay writes, virtually unlimited read/write cycles, and low power consumption. Pin-compatible with asynchronous static RAM (SRAM), the FM21L16 targets SRAM-based industrial control, metering, medical, automotive, military, gaming, and computing applications, among others.
4th October 2007

Toshiba Adds New 32GB and 16GB High Density SDHC Cards and 8GB microSDHC Card to Extensive Memory Card Line-up

Toshiba Adds New 32GB and 16GB High Density SDHC Cards and 8GB microSDHC Card to Extensive Memory Card Line-up
Toshiba Electronics Europe has reinforced its line-up of SD High Capacity (SDHC) cards with three new cards, including the world’s first 32-gigabyte (GB) memory card in this high density. Alongside the 32GB SDHC card, Toshiba also announced a 16GB SDHC card and an 8GB microSDHC card. All the new cards meet the Class 4 specification in the SD Speed Class, ensuring they deliver the high level performance and functionality essential for advanced mobile phones and other personal digital products.
3rd September 2007

STMicroelectronics Guarantees Full-Speed Operation of 32-Mbit Serial Flash Memory with Dual I/O

STMicroelectronics Guarantees Full-Speed Operation of 32-Mbit Serial Flash Memory with Dual I/O
STMicroelectronics has announced the availability of the new M25PX32, a 32-Mbit device that is the first of the sector, sub-sector erase Serial Flash family to be offered with Dual I/O. Whereas existing M25PE family devices features high granularity, the new M25PX family stands out thanks to its guaranteed high-speed performance.
27th August 2007

FRAM memory designed into DSP-based digital car audio system for Renault Samsung Motors

Ramtron International has announced that Daesung-Eltec Co. Ltd. of Korea has designed FRAM memory into its new digital signal processing (DSP)-based car audio platform. Daesung-Eltec selected the FM24C64 - a 64-kilobit FRAM with 2-wire serial interface – to enable sophisticated memory functions such as storing audio, channel and favourite artist/song settings, as well as the resume play and the favourite artist/song alert features. FRAM’s non-volatility, No Delay writes, virtually limitless endurance, small footprint and cost effectiveness make it the ideal memory technology for advanced digital automotive audio systems.
1st August 2007

NAND Controllers for Mobile Storage Applications

NAND Controllers for Mobile Storage Applications
Addressing the performance, compatibility, functionality and reliability needs of solid state mass storage solutions, SST (Silicon Storage Technology) has announced that it is expanding its NAND controller offerings with two new NAND controllers, the ATA Flash Disk Controller (SST55VD020) and the CompactFlash Card Controller (SST55LC200). Featuring an advanced error correction code (ECC) engine, these high-performance controllers are well positioned for managing current and future high-density NAND flash requirements. SST SuperFlash-based embedded firmware allows for firmware updates before, during and after manufacturing. Firmware update functions eliminate the need to re-design or re-qualify new controllers to meet the requirements of new NAND flash technology introduced after the system has been put into production. This allows system manufacturers to optimize NAND costs, availability and performance requirements in the face of fast-changing NAND technologies.
30th July 2007


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