Production
Soldering defects and soldering atmosphere
A typical question put to a manufacturer of reflow soldering systems like Rehm Thermal Systems is often: ‘What is the benefit of a nitrogen atmosphere?’ In the following Rehm has explored this question in relation to typical soldering defect scenarios, including those involving solder balls, beading, voiding, whiskers, graping, head-in-pillow, wetting defects and tombstones.
Turnkey solution encompasses test and programming
BARCUDA VP230 is a turnkey solution from GÖPEL electronic to flexibly test, program and put assemblies into functional mode.
Avoid bad solder joints and prepare for soldering
In this month’s issue of Hakko Tech Tips, the company has focused on an area that can cause a lot of issues. The simple reason being that we want to help iron those out for you this year. Correctly soldered joints on a PCB are essential to safely conduct currents and function efficiently inside a device.
Setting standards for graphene materials
Silicon was first discovered in 1787, but it wasn’t until the 1950s that it became widely used in industry. In contrast, the Graphene Flagship has been working to bring graphene to the market in just ten years. Determining accepted technical standards for graphene will play a large part in meeting that deadline. In this article, Thurid Gspann, Chair of the Graphene Flagship Standardisation Committee (GFSC), has explained why standardisation...
Power supply test card in demand at processor makers
Semiconductor test equipment supplier Advantest says that its DC Scale XPS256 Device Power Supply (DPS) card, developed for use with the V93000 EXA Scale SoC test system, is now ramping to production-volume test at leading makers of communications processors.
Inertec deal adds to Altus solder offering
Altus has strengthened its partnership portfolio by signing a new agreement to distribute and support equipment from Inertec, a supplier of innovative soldering technologies.
E-skin flat single pods for cleanrooms
igus has developed an ‘e-skin flat’ single pod - designed specifically to guide cables in compact and particle-free cleanrooms. To ensure quick and easy installation customers can use the e-skin flat to select and combine chambers and then insert the cables in seconds. There is also the option of a new support chain, which strengthens the e-skin flat.
Advantest lines up raft of new products at SEMICON Japan
More than a dozen of Advantest’s latest test solutions and products will be on show at the first-ever virtual SEMICON Japan (December 14-17) where once again the company will be a gold-level sponsor.
LPKF deal bolsters Altus laser-based solutions offering
Altus has added to its portfolio of production equipment by agreeing a deal to distribute LPKF’s laser-based solutions for the technology industry.
Cloud solutions boost efficiencies for IC designs
Working with its partner PDF Solutions, Advantest has introduced two new innovative cloud-based software solutions: the Advantest V93000 Dynamic Parametric Test (DPT) system powered by PDF Exensio DPT, and an edge high performance compute (HPC) system.